Quick Summary
Lithium Niobate (LiNbO₃) wafers come in 2″ to 6″ diameters and thicknesses of 0.5, 0.7, and 1.0 mm. Each combination offers distinct benefits for optical, acoustic, and photonic applications.
- 2″ – affordable for R&D
- 4″ – balance of yield & cost
- 6″ – best for volume production
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Orientation Highlights
The wafer’s orientation controls how light and acoustic waves behave. Choose wisely:
- X-cut: High acoustic velocity for SAW filters
- Y-cut: Stable performance, temperature-tolerant
- Z-cut: Access to the largest r₃₃ EO coefficient
- Rotated cuts: Tuned for coupling and thermal balance
Common Thickness Options
| Thickness | Application | Handling |
|---|---|---|
| 0.5 mm | Thin-film, optical modulators | Fragile, delicate edge support |
| 0.7 mm | Waveguides, EO experiments | Balanced, ideal for R&D |
| 1.0 mm | SAW, robust applications | Easy handling |
Material Insights
LiNbO₃ is known as the “optical silicon” of photonics — combining high refractive index (≈2.2), r₃₃ ≈ 30 pm/V, and transparency from 350 nm – 5200 nm. These properties remain stable across all wafer sizes, though uniformity control is more demanding for 6″ wafers.
Handling & Storage
- Use Class 100 or better cleanroom environment
- Handle by edges only to prevent contamination
- Store at stable temperature to avoid pyroelectric charging
- Use antistatic shippers for 4″ + wafers
LiNbO₃ is pyroelectric — avoid sudden thermal changes to prevent surface charge buildup and particle attraction:contentReference[oaicite:2]{index=2}.
Industry Perspective
“Smaller wafers remain the workhorses of R&D, while larger wafers
are the backbone of scalable production.”
This duality ensures LiNbO₃ stays central to both academic and commercial photonics.
Compare Lithium Niobate (LiNbO₃) Wafer Sizes: 2″–6″
Lithium Niobate wafers are offered from 2″ to 6″ in diameter with common thicknesses of 0.5 / 0.7 / 1.0 mm and standard X-cut and Z-cut orientations. Picking the right size balances performance, budget, and handling—smaller wafers excel in research; larger wafers shine in production. :contentReference[oaicite:0]{index=0} :contentReference[oaicite:1]{index=1}
When to Choose Each Diameter
2″ (50.8 mm) — Research & Process Development
Best for early-stage work and student labs: easy manual handling, lower material cost, and plenty of die area for test structures and prototypes on each wafer. :contentReference[oaicite:2]{index=2}
3″ (76.2 mm) — Scaling Experiments
A practical step up when you need more devices per run but still want manageable manual handling and modest consumable usage. Many labs use 3″ when moving from proof-of-concept toward repeatable processes. :contentReference[oaicite:3]{index=3}
4″ (100 mm) — Pilot Production
Preferred in pilot lines and small-volume production. 4″ increases throughput and reduces per-device cost once masks, recipes, and metrology are stable. :contentReference[oaicite:4]{index=4}
6″ (150 mm) — Volume & Automation
Optimized for high-volume fabs with automation. Larger area multiplies die count per run, improves cost per device, and aligns with automated transfer/inspection workflows. :contentReference[oaicite:5]{index=5}
Thickness: 0.5 / 0.7 / 1.0 mm — What Changes?
- 0.5 mm — suited for optical modulators and thin-film devices; more fragile, requires careful handling. :contentReference[oaicite:6]{index=6}
- 0.7 mm — versatile “general-purpose” thickness; good balance of mechanical strength and optical path. :contentReference[oaicite:7]{index=7}
- 1.0 mm — robust for SAW and mechanically demanding flows; easier handling on benches and tools. :contentReference[oaicite:8]{index=8}
Crystal Orientation: Selecting X-cut vs Z-cut (and more)
Orientation determines EO access, acoustic velocity, and thermal behavior. Typical choices:
- X-cut — favored for SAW and some EO layouts; high acoustic velocity for RF/telecom filters. :contentReference[oaicite:9]{index=9}
- Y-cut — used where specific polarization/EO interactions are needed. :contentReference[oaicite:10]{index=10}
- Z-cut — access to the largest r33; go-to for high-efficiency modulators and nonlinear optics. :contentReference[oaicite:11]{index=11}
- Rotated cuts (e.g., 128°Y) — tuned temperature stability and K² for SAW; specialized RF performance. :contentReference[oaicite:12]{index=12}
Research vs. Production: How the Choice Evolves
Research groups typically start with 2″–3″ for cost and flexibility, then scale to 4″–6″ as device counts rise and processes mature—mirroring industry’s trend to larger wafers for throughput and cost per die. :contentReference[oaicite:13]{index=13} :contentReference[oaicite:14]{index=14}
Handling & Storage by Size (Key Practices)
Larger wafers demand disciplined protocols: automated handling, Class-100 (or better) cleanroom practices, controlled temperature/humidity storage, edge handling, and purpose-built shippers. Use automated transfers and lot tracking where possible. :contentReference[oaicite:15]{index=15}
Remember: LiNbO₃ is pyroelectric. Avoid rapid temperature swings and consider ionizing air to neutralize surface charge—especially on larger wafers where charging is more pronounced. :contentReference[oaicite:16]{index=16}
What to Specify When You Request a Quote
- Diameter & thickness (e.g., 2″/0.5 mm, 4″/0.7 mm, 6″/1.0 mm). :contentReference[oaicite:17]{index=17}
- Orientation/cut (Z-cut for modulators; X-cut/rotated cuts for SAW). :contentReference[oaicite:18]{index=18}
- Surface grade (optical polish, target roughness, flatness/bow/warp). :contentReference[oaicite:19]{index=19}
- Optical quality metrics (Δn homogeneity, absorption @ 1550 nm, birefringence uniformity). :contentReference[oaicite:20]{index=20}
Takeaway
Choose smaller wafers to iterate quickly and affordably; move to larger diameters for yield, automation, and better unit economics. Match thickness and orientation to the device physics you need, and enforce handling protocols that respect LiNbO₃’s pyroelectric nature. :contentReference[oaicite:21]{index=21}