Immediate response. Fast delivery. Guaranteed quality.
What services can we provide? We have a large selection of bare silicon wafers that we can thin, dice, deposit thermal oxide, nitride, metals and more! We sell as few as one wafer, thus making our substrates more affordable.
Researchers use our substrates for various purposes including microfluidics research, virtual reality glasses, spin coating etc.
Clients save our inexpensive diced Silicon-on-Insulator wafers from Soitec that are very difficult to buy in small quantities.
Below are just some samples of how we help researchers find the right substrate at a great price with fast delivery.
We help companies liquid their inventory and often have access to hard to find substrates at below market prices and in small quantities.
For example we have 6 inch and 8 inch inventory of SUMCO silicon wafers available for immediate delivery.
Can you help me? Please quote HRFZ Silicon, Double side polished, more than 10k Ohm resistivity 2".
UniversityWafer, Inc. Reply
Our offer for the wafer for Terahertz applications
HRFZ Silicon 50.8mm Undoped (100) or (111) >10,000 ohm-cm >/=280um DSP PRIME FZ, Intrinsic, TTV<10um, Bow/Warp<30um, SEMI Flats.Qty. 10
$23.98usd/ea; 1~2 week delivery
We have requirements for Fused Silica Windows Duly Polished: Fused Silica Wafer UV Grade (JGS1) Diameter = 50mm x Thick = 2.00mm Qty. 25 Pcs. Diameter = 50mm x Thick = 2.50mm Qty. 25 Pcs. Optical specifications: Surface 1: Surface Flatness: wave/4 (PV) @633 nm Surface irregularities < 5 nm Surface 2: Polished Scach-dig: 60/40 Kindly send us your lowest quote for the same. An early reply will be highly appreciated.
UniversityWafer, Inc. Quoted
The flatness you assigned here is Lambda/4, so it is 158nm, so irregularity must be even better than 158nm, are you mean the flatness cna be 5um, see our quotation below:
1) Fused Silica Window
Diam50x2.0mm thick, DSP
Quantity: 25 Pieces
FOB Price: $15.90 each
Delivery Time: 2 Weeks
2) Fused Silica Window
Diam50x2.5mm thick, DSP
Quantity: 25 Pieces
FOB Price: $16.90 each
Good morning, I am interested in fabricating my own GaN LEDs for chip assembly research. In our facilities in the TU Ilmenau, we donÂ´t have the technology to grow epi layer, so we are looking for a provider who can give us a substrate with the necessary layers on top, so that we just etch and contact it. Do you have any product that may suit our needs?
UniversityWafer, Inc. Quoted
The specific epi structure are ok,Pls see below for the offer 4'' GaN on Silicon <111> Blue LED Wafer
4'' Si-Based <111> LED GaN Epi structure Blue LED Wafer,Specific epi structure(susbstrate example),Qty: 10-25
Researcher asked for the following quote:
I need 4x 4" diameter (SiC) wafers, polished to 38, 40, 46, and 53 um. Each wafer needs to be diced to 7x di, each di is 30 mm x 25 mm. Please let us know if this is possible and/or if we can discuss other options.
UniversityWafer, Inc. Quoted:
4" Diameter diced to 7pcs of 30mm x 25mm
Thickness: 38um, 40um, 46um, 53um, tolerance<5um
Researcher Replies and Then Order:
Yes, we would like to order these parts from you. A couple of things before we can place the order:
1. What is the lead time?
2. Can you send the di as they are ready?
3. Can you start with the 53 um wafer and send a di ASAP? We have some thermal experiments we need to perform with it.
4. Can you please provide a formal quote (PDF)? I have to submit this request through our university purchasing department.
5. I saw on the website there is a "research discount." Has this been applied? These will be used for nuclear research applications.
It will still be on the wafer dicing tape? I have done Si wafer dicing before (with thicker Si than this), and getting the die off without breaking them can be hard! I am worried about doing this myself, especially with such thin wafers.
Some dicing tape needs to be exposed to UV to remove the adhesive. We don't have this capability readily available in our lab. Can you please advise how we will be able to get the die off the tape? Will this be a trivial process? Are there special tools or chemicals we will need?
Is it possible to receive the die without the wafer tape attached?
UniversityWafer, Inc. Replied:
We need to attach the tape on wafers that are under 100um to avoid the breakage during the transportation. So we need customers to do the UV irradiation by themselves after they received the wafer. Please let me know if your customer really needs the die wafer without the tape attached, I will go talk to our manufacturer but there might be a price increase.
Researchers Asked The Following:
Chris Do you accept customized thickness sapphire wafer order? We want to order sapphire wafer with size of 100mm, thickness of 800um. These wafer will be used as backing wafer for GaAs grinding/polish process. Qty is 10 pieces. Rest of the spec same as you standard sapphire product: 2562. C-M plane 0.2°, Double Side Polished, Micro-roughness: Ra<0.35nm, Primary flat length: 32.5±2.5mm. Warp<21um, TTV<16um.
UniversityWafer, Inc. Quoted and Researcher Purchased:
100mm, thickness of 800um. used as backing wafer for GaAs grinding/polish process. Qty is 10 pieces. Rest of the spec same as you standard product: 2562. C-M plane 0.2°, Double Side Polished, Micro-roughness: Ra<0.35nm, Primary flat length: 32.5±2.5mm. Warp<21um, TTV<16um. (254745)
Scientists have used the following thermal oxide item for Biomedical applications
Si Item #1583
100mm P/B <100> 0.001-0.005 ohm-cm 500um SSP Prime w/ 300nm Wet Thermal Oxide with Thickness Tolerance +/- 7%
Researcher purchased the following quartz substrate.
"We are using the quartz plates for manufacturing samples for laser experiments. When hitting the sample with the laser it will be damaged so that we need to purchase quartz crystals over the over again until the project is completed."
Seedless Quartz Item #3064
50.8mm Z-cut 50um DSP Seedless
11 Elkins Street