Thin silicon wafers used in solar panels have a few advantages over the standard 160 μm wafers.
50 μm wafers substrates could potentially reduce the cost of fabricating solar panels capex by 48%, module cost by 28%, and LCOE by 24%.
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UniversityWafer, Inc. and our partners have developed a new process for producing ultra-thin silicon wafers that can be processed with standard semiconductor equipment on flexible substrates. To provide a more flexible substrate for the production of ultra-thin semiconductors, we have started to produce thicker silicon rings to support ultrasonic wafers. We develop new processes for the production of thin-ring silicon with a thickness of less than 1 micrometer (micrometer) and a diameter of only 1 mm.
Below are just some of the thickness wafers that we have in stock:
Other wafer thicknesses are available.
Climate change (formally referred to as global warming) is the greatest problem earth faces today. Scientists are urgently researching how to transition to a carbon-neutral energy system using the sun’s solar rays. Using current technologies, scientists have proven that the thinner the solar panel the greater the overall efficiency of production and solar capture. UniversityWafer, Inc. has assisted scientists in their quest for thin-silicon used to fabricate solar modules.