Researchers have used D263 Glass wafers cleaving model was investigated based on the principle of thermal stress fracture. The thermal stress in the material was calculated. Experimental studies were performed to investigate the processing parameters, and D263 glass sheet with thickness of 300 µm was cut, resulting in micro crack-free edges with a surface roughness of 0.5 nm. The proposed process was also applied to cut X-ray telescope lenses substrates with no micro cracks. Compared with diamond scribing and laser cutting, the proposed method is lower capital costs and yields a nondestructive cut surface for glass. The technique can be applied in manufacturing glass products (i.e. lenses, solar cells, glass screen).
Researchers have used D263 glass for consistent microchip fabrication with smoothly etched channels for more accurate readings.
University scientists have researched the causes of rough etching including the effect on different glass including D263 glass substrate annealing on improving rough etching and etching of a different form of borosilicate glass. The scientists have discovered that D263 glass has advantages over Borofloat glass wafers.