D263 Glass Windows for Research & Production

University Wafer Silicon Wafers and Semicondcutor Substrates Services
University Silicon Wafer for Production

What are D263 Glass Wafers used for?

Researchers have used D263 Glass wafers cleaving model was investigated based on the principle of thermal stress fracture. The thermal stress in the material was calculated. Experimental studies were performed to investigate the processing parameters, and D263 glass sheet with thickness of 300 ┬Ám was cut, resulting in micro crack-free edges with a surface roughness of 0.5 nm. The proposed process was also applied to cut X-ray telescope lenses substrates with no micro cracks. Compared with diamond scribing and laser cutting, the proposed method is lower capital costs and yields a nondestructive cut surface for glass. The technique can be applied in manufacturing glass products (i.e. lenses, solar cells, glass screen).

Microchip Fabrication Using D263 Borosilicate Glass Wafers

Researchers have used D263 glass for consistent microchip fabrication with smoothly etched channels for more accurate readings.

University scientists have researched the causes of rough etching including the effect on different glass including D263 glass substrate annealing on improving rough etching and etching of a different form of borosilicate glass. The scientists have discovered that D263 glass has advantages over Borofloat glass wafers.

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D263 Schott Glass Windows

Our clients use our Schott D263 glass for the following applications:

  • Touch Panel Controls
  • Liquid Crystal Displays (LCD)
  • Electroluminescent Displays
  • Solar Cell Protective Glass

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D263 Glass