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Wafer bonding is a procedure of bonding glass to silicon without any intermediate layer. This bonding technique used for
Bonding Silicon to Glass
Metal to Glass
The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions.
For anondic bonding we have Borofloat 33. We used to sell Pyrex 7740 but that product has been discontinued by the manufacturer.
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