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Bonding glass to silicon wafers or metal is called anodic bonding. It requires a flat particle free surface using a strong electrostatic field. The anodic wafer bonding process is commonly used to seal glass to silicon wafers in electronics and microfluidics. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon wafers to glass windows and metal surfaces to glass using an electric fields. Both the glass and silicon or metal require a glass coefficient of thermal expansion (CTE) to be similar to those of the silicon or metal.
Wafer bonding is a procedure of bonding glass to silicon without any intermediate layer. This bonding technique used for
Bonding Silicon to Borosilicate Glass
Metal to Glass
The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions.
For anondic bonding we have borosilicate. We used to sell Borofloat 33, Pyrex 7740 but that product has been discontinued by the manufacturer.
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