Silicon wafers with gold deposited onto the surface are used in soft lithography for micro and nanoscale patterning.
Deposition Technique: Electron Beam
Deposition Rate: 1-2 Å/sec
Vapor Pressure: 10-6 Torr
Adhesion Layer: Cr (99.99%)
We have gold coated Si wafers and we can deposit gold onto most any substrate. A thin layer of titanium (Ti) is used as an adhesion layer so the gold easily bonds to the single crystal silicon wafer.
Please email the specs and quantity that you would like.
Research Client Asks:
I need some gold-coated Si wafers. Gold thickness between 50-200 nm either sputtered or evaporated would be fine. These will be diced so wafer size is not critical - please use the below as a guide but let me know what you have in stock and/or what gives the best area/$. Could you please send me prices for: 1 x 4" wafer 10 x 4" wafer 1 x 6" wafer Are you able to offer a wafer dicing service for these? If so, please let me know the cost for dicing into 10x10 mm squares.
I only care about one side having a well-adhered gold layer – this is for an electrochemical sensor application. In the past I have always used something like: Boron doped 10-100 Ohm-cm <100> SSP, usually with 200 or 300 nm of a thermal oxide. In this application I don’t think the oxide layer is actually necessary.
UniversityWafer, Inc.'s Response:
The following wafers will work:
Si Item #1432
100mm P/B <100> 1-10 ohm-cm 500um SSP Prime
Si Item #3495
150mm P/B <100> 1-30 ohm-cm 620-675um SSP Prime with 300nm of Thermal Oxide