Single Side Polished (SSP) Silicon Wafers

University Wafer Silicon Wafers and Semicondcutor Substrates Services
University Silicon Wafer for Production

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100mm silicon wafers Single Side Polished (SSP)

 

Single Side Polished Silicon Wafers

We have a wide variety of Single Side Polished (SSP) Wafers in stock. We have thicknesses from 100 micron up to 10mm in thickness. We flatness spec as tight as 1 micron total thickness variation (TTV)

Please email us the specs and quantity you would like us to quote or you can buy online!

Item Type/Dopant Orient. Diam (mm) Thck (um) Pol Resistivity ohm-cm Comment
K148 Intrinsic Si:-- [100] 1" 300 SSP FZ >20,000 Prime, NO Flats, Soft cst
D355 Intrinsic Si:-- [100] 1" 320 SSP FZ >20,000 Prime, NO Flats, Soft cst
5447 Intrinsic Si:-- [100] 1" 500 SSP FZ >20,000 SEMI Prime, 1Flat, hard cst
5275 p--type Si:B [100] 1" 1,000 SSP 1--30 SEMI Prime, 1Flat, hard cst
L678 p--type Si:B [100] 1" 3,000 SSP 1--50 Prime, NO Flats, Individual cst, Group of 13 wafers
5092 p--type Si:B [100] 1" 275 SSP 0.015--0.020 SEMI Prime, 1Flat, Soft cst
S5554 p--type Si:B [111] ±0.25° 3" 400 SSP FZ >100 SEMI Prime, 1Flat, Empak cst
4994 n--type Si:P [100] ±0.1° 3" 380 SSP FZ >5,000 SEMI Prime, 1Flat, Empak cst
I978 n--type Si:P [111] ±0.5° 3" 380 SSP FZ 4,000--8,000 SEMI Prime, 1Flat, in hard cassettes of 1 & 2 wafers
E383 n--type Si:P [111] ±0.5° 3" 380 SSP FZ 3,000--5,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000?s,
6773 Intrinsic Si:-- [100] 3" 380 SSP FZ >20,000 SEMI Prime, 1Flat, Empak cst
6116 p--type Si:B [100] 3" 5,000 SSP 1--30 Prime, NO Flats, Individual cst
3014 p--type Si:B [100] 3" 250 SSP 0.15--0.20 SEMI TEST (Scratches), 2Flats, in sealed Empak cassettes of 3 wafers
S5843 p--type Si:B [100--4° towards[110]] ±0.5° 3" 230 SSP 0.01--0.02 SEMI Prime, 2Flats, Empak cst, TTV<5?m
2248 p--type Si:B [100] 3" 300 SSP 0.01--0.02 SEMI Prime, 2Flats, Empak cst
S5844 p--type Si:B [100--4° towards[110]] ±0.5° 3" 381 SSP 0.01--0.02 SEMI Prime, 2Flats, Empak cst, TTV<5?m, Cassettes of 4 and 20 wafers
C260 p--type Si:B [110] ±0.5° 4" 500 SSP FZ >15,000 {16,453--18,686} Prime, 2Flats, SEMI Flats, PF at<111>, SF at <111> 70.5° CW from PF, Empak cst
6268 p--type Si:B [110] ±0.5° 4" 500 SSP FZ >10,000 Prime, 2Flats, TTV<5?m, SEMI Flats, PF at<111>, SF at <111> 70.5° CW from PF, Empak cst
6927 p--type Si:B [100] 4" 525 SSP 1--10 SEMI Prime, 2Flats, Empak cst
6632 p--type Si:B [100] 4" 1,000 SSP 1--5 SEMI Prime, 1Flat, Empak cst, TTV<5?m
4829 p--type Si:B [100] 4" 2,100 SSP 1--100 SEMI Prime, 1Flat, Individual cst, Groups of 5 wafers
6521 p--type Si:B [100] 4" 2,100 SSP 1--100 SEMI Prime, 1Flat, Individual cst, Manual Edges, Grouops of 2 + 10 + 10 wafers
6575 p--type Si:B [100] 4" 3,000 SSP 1--30 SEMI Prime, 2Flats, Individual cst
6592 p--type Si:B [100] 4" 5,000 SSP 1--100 Prime, NO Flats, Individual cst, Group of 3 wafers
6854 p--type Si:B [100] 4" 525 SSP 0.1--0.2 SEMI Prime, 2Flats, Empak cst
3031 p--type Si:B [100--6° towards[110]] ±0.5° 4" 525 SSP 0.015--0.020 SEMI Prime, 2Flats, Empak cst
6349 p--type Si:B [100] 4" 525 SSP 0.01--0.02 SEMI Prime, 2Flats, Empak cst, TTV<5?m
H548 p--type Si:B [100] 4" 525 SSP 0.01--50.00 SEMI Test, 1Flat, Empak cst
6719 p--type Si:B [100] 4" 525 SSP 0.001--0.005 SEMI Prime, 2Flats, Empak cst, TTV<5?m
6900 p--type Si:B [100] 4" 525 SSP 0.001--0.005 SEMI Prime, 2Flats, Empak cst
I374 p--type Si:B [111] 4" 350 SSP 2--3 Prime, NO Flats, Empak cst
TS043 p--type Si:B [111--2.5°] ±1° 4" 450 SSP 2--8 {3.8--4.8} SEMI Prime, 1Flat, {actually (449--457)?m thick}, Empak cst
D372 p--type Si:B [111--3°] 4" 400 SSP 0.015--0.018 SEMI Prime, 1Flat, Empak cst
TS008 p--type Si:B [111] ±1° 4" 380 ±10 SSP 0.010--0.015 {0.0124--0.0136} SEMI Prime, 1Flat, Empak cst, TTV<8?m
4279 p--type Si:B [111--4°] ±0.5° 4" 525 SSP 0.01--0.02 SEMI Prime, 1Flat, Empak cst
F508 p--type Si:B [111] ±0.5° 4" 525 SSP 0.01--0.02 SEMI Prime, 1Flat, Empak cst, TTV<3?m, Bow<10?m, Warp<30?m
G508 p--type Si:B [111] ±0.5° 4" 525 SSP 0.01--0.02 SEMI Prime, 1Flat, Empak cst, TTV<3?m, Bow<10?m, Warp<30?m
TS033 p--type Si:B [111--4°] ±0.5° 4" 525 SSP 0.01--0.02 {0.0140--0.0186} SEMI Prime, 1Flat, Back--side: Hard--Damage, Empak cst
TS077 p--type Si:B [111--4°] ±0.5° 4" 525 SSP 0.01--0.02 {0.0140--0.0186} SEMI Prime, 1Flat, Empak cst (4+5+5+10+15+20 wafers)
TS038 p--type Si:B [111--3.5°] ±0.5° 4" 525 ±15 SSP 0.007--0.009 {0.0071--0.0085} SEMI Prime, 1Flat, Empak cst, TTV<5?m
TS069 p--type Si:B [111--3.5°] ±0.5° 4" 525 ±15 SSP 0.007--0.009 {0.0071--0.0085} SEMI Prime, 1Flat, Empak cst, TTV<5?m
TS031 p--type Si:B [111--3.5°] ±1° 4" 475 SSP 0.005--0.020 {0.0138--0.0150} SEMI Prime, 1Flat, Back--side Acid Etch, Empak cst
TS007 p--type Si:B [110] ±0.25° 6" 625 ±15 SSP 10--20 {13.6--13.9} SEMI Prime, 1 JEIDA Flat 47.5mm @ <111>±0.5°, LaserMark, TTV<2?m, Warp<10?m,Empak cst
TS072 p--type Si:B [110] ±0.25° 6" 625 ±15 SSP 10--20 SEMI Prime, 1 JEIDA Flat (47.5mm) @ <111>±0.5°, Laser Mark, TTV<3?m, Bow<5?m, Warp<10?m, Empak cst
6427 p--type Si:B [110] 6" 675 SSP 0.01--0.02 Prime, PFlat @ [111]±0.25°, SF @ [111]±5° 109.5° CW from PF, Empak cst
TS054 p--type Si:B [100] 6" 675 SSP 15--25 {16.1--21.7} SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5?m
6287 p--type Si:B [100] 6" 675 SSP 5--10 SEMI Prime, 1Flat (57.5mm), Empak cst
6751 p--type Si:B [100] 6" 1,000 SSP 5--10 SEMI Prime, 1Flat (57.5mm), Empak cst
6358 p--type Si:B [100--6° towards[111]] ±0.5° 6" 675 SSP 1--30 SEMI Prime, 1Flat (57.5mm), Empak cst
N698 p--type Si:B [100] 6" 675 SSP 1--100 SEMI Prime, 1Flat (57.5mm), Empak cst
TS055 p--type Si:B [100] 6" 675 ±15 SSP 0.01--0.02 {0.0102--0.0133} SEMI Prime, 1Flat (57.5mm), Empak cst
6005 p--type Si:B [100] 6" 320 SSP 0.001--0.030 JEIDA Prime, Empak cst