HRSI are used for Radio Frequency (RF), MEMS and dielectric wave guides, resonators.
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Soitec has launched its second generation of wafers, called eSI90, an improved signal integrity substrate. The carbon-doped amorphous silicon layer is a spilled oxide layer in which there is a layer of carbon dioxide (CO2). This is the first of its kind in the world and one of the most advanced silicon substrates available today. [Sources: 1, 5]
The silicon insulator structure  consists of two layers of buried oxides and a layer of carbon-doped amorphous silicon. It consists of a silicon layer with a buried oxide layer on the silicon and a carbon dioxide layer underneath. The silicone structure  consists of two layers of oxide, one of which is buried in the oxide material and the other at the top. [Sources: 0]
The high resistance of the silicon substrate  is deposited by a thin layer of silicon dioxide  and serves to prevent leakage of electricity from the substrate. This results in a lower substrate loss due to parasitic components and can be measured at microwave frequencies using a high - high-performance, low - cost and low - to noise ratio . [Sources: 5, 7, 8]
N, the team used three types of silicon wafers for the experiments: N - phosphorus - doped, nitrogen - doped and silicon dioxide - doped. [Sources: 6]
N, the researchers used three types of silicon wafers for the experiments: N - phosphorus - doped, nitrogen - doped and silicon dioxide - doped. Phosphorus doping: The researchers used three types of silicon wafers for this experiment, with N-phosphorus doping and nitrogen doping being the main components. N they used all three types of silicone wafers: phosphorus dopters, nitrous oxide dopes and nitrogen dioxide dopters. [Sources: 4]
The electrical resistance is 100 o / cm or more, also called ano, and corresponds to a silicon wafer with an electrical resistance of 100 - 100%. The electrical resistance in it is equal to or greater than a 1.5 o / cm2 silicone wafer, which refers to a a5x105 piece or a 10x10 cm2 silicone wafer. [Sources: 9, 11]
According to the present invention, BMD (Bulk Micro Defect) requires a dense oxygen loss of the waferato of 5a107 pieces per cm3 or less. It is also necessary if there is a 5x107 piece of Percm3 or less, and it is necessary to require a BMD (Bulk Microdefect) according to our current inventions. [Sources: 9, 11]
Dale Margrave has shown that silicon difluoride can be obtained in the wafer with an oxygen loss of only 2.5 - 3%. Using this loss, the value is quaked by improving the tangent of silicon oxide by 6 - 10.3% to stoichiometric silicon dioxide. [Sources: 8, 10]
Unfortunately, there is a problem related to the presence of reactive silicon quantum dots on the surface of the silicon difluoride wafer. This limitation can be removed with porous silicon by creating a reactive silicon quantum dot on a free-standing porous silicon film. [Sources: 10, 12]
Carbon - doped amorphous silicon layers produced on high-resistance substrates were measured by secondary ion mass spectrometry. The doping agents determine the type of silicon (positive or negative) and also change the resistance of the silicon. For example, we see that the surface is stabilized by the high-impedance silicon and that wave-guided resistance (WG - G - W) increases with the presence of reactive silicon quantum dots (Fig. 2). [Sources: 0, 5, 13]
The present invention was made on the basis of the above study and the following description (1,5) is the first step towards the invention of high-resistance silicon wafers. The following descriptions (2.0) and (5.1) are the first steps towards the development of a new type of highly resistant silicon, and thus invented high resistances of silicon on a wafer (Fig. 2). The inventions at hand are based on the above-mentioned studies and were the beginning of an innovative approach to the development and production of new types of low-resistance and high-performance silicon. [Sources: 11]
(1) represents a silicon wafer (see FIG. 1) consisting of a buried oxide layer (4) having a positive charge of 6 and demonstrates the process of producing highly resistant silicon (1,5,6,7,8,9,10,11,12,13). [Sources: 2, 3]
Although no reference is made to a silicon semiconductor wafer, other materials can be used to manufacture semiconductor wafers, although no reference is made to silicon, which is made of silicon. Although noreference refers to the manufacturing process of a silicon wafer. While no reference to any other material used in the manufacture of an S-WAFer will be included, no other materials may be used in the manufacture of a prepared S-WAFer. [Sources: 0]