What Silicon-on-Insulator Specs do I Need?
Silicon-on-Insulator (SOI) wafers are the backbone of today’s high-performance and energy-efficient semiconductor devices. 
Bonded SOI wafers, created by joining two silicon wafers with a precisely engineered insulating oxide layer, are widely used in CMOS, MEMS, and photonics, where uniform device layers and superior performance are essential. SIMOX SOI wafers (Separation by Implanted Oxygen), formed by implanting oxygen ions into a silicon wafer and annealing to produce a buried oxide layer, are especially valued in low-power and high-speed applications such as RF, logic, and advanced sensing. Together, bonded SOI and SIMOX technologies reduce parasitic capacitance, minimize leakage, and improve scaling — making them ideal choices for next-generation devices. Explore our full range of SOI wafers to accelerate your research and product development today.
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What is SOI?
Silicon on Insulator (SOI) is a manufacturing method that reduces the capacity of parasitic components and thus increases performance. Si wafers are the main components of the integrated circuits found in our daily electronic devices. Si wafers are the main component of an integrated circuit found on a wide range of devices including smartphones, tablets, computers and other electronic devices.
Si wafers produced in this way are suitable for the production of mobile phones, and to give you an overview, here are the different production methods for SOI.
SOI Wafer Bonding Descriptions
In wafer bonding, the surface of the two wafers is covered with an oxidising layer and the oxide layer is bonded to the surface of the silicon.
The insulating layer holds the two wafers together, while the oxide layer is buried under the semiconductor stage (BOX). Once the desired thickness of semiconductors is reached, the surface of the wafer is polished and overlapped.
SIMOX SOI
The process creates a layer of buried oxide resin by irradiating a semiconductor wafer with oxygen ions and curing it at high temperatures. The ion energy determines the thickness of the intrinsic semiconductors, and the amount of oxides in the resin increases with the energy of the ion.
SMART CUT SOI
In this method, hydrogen ions are used to control the thickness of the top silicon layer, while after the implantation process, hydrogen ions are repelled in a size-controlled manner. This gap can be reused to produce other SOI wafers, and this method can also be used for other purposes, such as the production of new silicon chips.
What Is SOI Technology?
SOI (Silicon on Insulator) technology is a method used in semiconductor manufacturing where a thin layer of silicon is separated from the bulk substrate by an insulating layer — usually silicon dioxide (SiO₂).
- Top Layer: Thin Silicon (active layer for devices)
- Middle Layer: Silicon Dioxide (buried oxide or BOX)
- Bottom Layer: Handle Silicon (support substrate)
Why Use SOI?
SOI wafers offer several electrical and thermal advantages over traditional bulk silicon:
| Feature | Benefit |
|---|---|
| Reduced parasitic capacitance | Faster switching speeds and lower power consumption |
| Improved isolation | Less interference between transistors |
| Better radiation hardness | Ideal for space and military electronics |
| Lower leakage current | Key for low-power mobile and IoT devices |
| Improved thermal performance | Better heat dissipation at the device level |
Applications of SOI:
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📱 Mobile processors (e.g., IBM, Apple chips)
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🚀 Aerospace & defense (radiation-hardened devices)
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💡 Optoelectronics (photonic ICs & sensors)
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🧠 AI and HPC chips (for low-power, high-speed operations)
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🧪 MEMS devices (micro-mirrors, pressure sensors)
Types of SOI:
| Type | Description |
|---|---|
| FD-SOI (Fully Depleted SOI) | Used in low-power, high-performance chips. More modern. |
| PD-SOI (Partially Depleted SOI) | Older generation, used in earlier IBM processors. |
The Most Commonly Used Silicon-on-Insulator (SOI) Wafers and Their Applications
Silicon-on-Insulator (SOI) wafers are a game-changer in modern semiconductor technology. By placing an insulating oxide layer between the silicon substrate and the active device layer, SOI wafers reduce parasitic capacitance, lower leakage currents, and enable higher speed with lower power consumption. Today, both bonded SOI wafers and SIMOX SOI wafers (Separation by IMplanted OXygen) are widely used in industries ranging from consumer electronics to aerospace. Below, we highlight the most common applications where SOI wafers are driving innovation.
📱 Mobile Processors (e.g., IBM, Apple chips)
Mobile devices demand ultra-low power consumption while maintaining high-speed performance. SOI wafers make this possible by minimizing leakage currents and improving transistor switching speeds. Leading companies such as IBM and Apple have adopted SOI technology in their mobile processors to achieve superior performance, longer battery life, and reduced heat dissipation. Bonded SOI wafers are particularly common here, as they provide the device uniformity needed for large-scale CMOS manufacturing.
🚀 Aerospace & Defense (Radiation-Hardened Devices)
In aerospace and defense, reliability is everything. Devices used in satellites, spacecraft, and military systems must withstand intense radiation and extreme conditions. Radiation-hardened SOI wafers are the standard solution because the buried oxide layer effectively isolates transistors, preventing charge buildup caused by radiation. Both bonded SOI and SIMOX wafers are used, but SIMOX wafers are especially valued in defense-grade electronics due to their robustness under radiation exposure.
💡 Optoelectronics (Photonic ICs & Sensors)
Optoelectronic devices—such as photonic integrated circuits (PICs), optical waveguides, and sensors—thrive on SOI technology. The buried oxide layer provides excellent optical confinement, making SOI photonics wafers the foundation of modern data communications and sensing devices. Bonded SOI wafers with thick oxide layers are most commonly used for photonics, as they enable precise light propagation with minimal loss. Applications range from high-speed internet communications to LiDAR sensing in autonomous vehicles.
🧠 AI and High-Performance Computing (HPC) Chips
Artificial Intelligence (AI) and High-Performance Computing (HPC) require chips that can handle massive data loads at high speed while keeping energy efficiency in check. SOI wafers help achieve this balance by enabling smaller, faster transistors with reduced power leakage. Many HPC and AI processors use bonded SOI wafers for their excellent scalability and integration with advanced CMOS nodes. As demand for faster, greener computing grows, SOI technology is becoming a critical enabler for AI-driven industries.
🧪 MEMS Devices (Micro-Mirrors, Pressure Sensors)
Micro-Electro-Mechanical Systems (MEMS) are everywhere—from automotive sensors to medical diagnostics. SOI wafers play a vital role in MEMS fabrication thanks to their mechanical stability, precise device layer control, and compatibility with bulk micromachining. Common MEMS devices built on SOI include micro-mirrors for optical switching, accelerometers, gyroscopes, and pressure sensors. Bonded SOI wafers dominate this space, as they allow highly repeatable and reliable device structures.
Conclusion: Why Choose SOI Wafers?
From smartphones to satellites, Silicon-on-Insulator wafers are at the heart of the most advanced technologies of our time. Bonded SOI wafers offer precise control and high uniformity, making them ideal for CMOS, MEMS, and photonics. SIMOX SOI wafers, created through oxygen implantation, provide excellent radiation tolerance and are favored in defense and low-power electronics. Together, these SOI wafer technologies are empowering the next generation of processors, sensors, and photonic systems.
👉 Explore our wide selection of SOI wafers in stock to accelerate your research, prototyping, and production needs.