Silicon substrates are mainly used for power semiconductors in automotive, electronics and HF front-end pa. silicon that can be fused with other materials, such as thermal oxide and or silicon nitride.
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We have the following nitride growth methods:
Low Stress Nitride
Super Low Stress Nitride
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In semiconductors a silicon wafer is also referred to a silicon slice and silicon substrate. Think of a substrate like a wall which can be painted on, or wall papered. It's the base for which microelectronics are etched onto the surface.
Each silicon substrate diameter has a semiconductor standard thickness. For example 100mm silicon substrate standare thickness is 550 microns +/-25 microns. Crystalline silicon (c-Si) subsrate is processed into Integrated Circuits (ICs) and solar applications. The silicon substrate is the base used to fabricate micro-electronic devices on the surface.
The steps to make a silicon subsrate chip includes:
FOBS substrate carrier available.
We have thin silicon substrates that are as thin as 5um. More commonly we have 50-100 micron in stock.