“We are looking to purchase 50 wafers, 300mm (for a training center). They will not be processed, but will be used for robot handling training. Is this something you sell?”
300mm Silicon Wafers in Multiple Grades and Specifications
UniversityWafer supplies 300mm silicon wafers for semiconductor research, equipment qualification, process development, thin-film deposition, robotics training, and device fabrication. Also commonly called 12-inch silicon wafers, these large-diameter substrates are available with a range of electrical, mechanical, and surface specifications.
Available options may include:
- Prime Grade – For demanding semiconductor processing, device fabrication, and research.
- Test Grade – For process development, equipment testing, deposition, and qualification.
- Mechanical Grade – A cost-effective option for robot handling, equipment setup, training, and mechanical testing.
- Reclaim Wafers – Suitable for selected non-device and process-development applications.
- CZ and FZ Silicon – Crystal-growth options are available depending on the required electrical and material properties.
Specifications vary by inventory and can include P-type, N-type, or undoped silicon, different resistivity ranges, (100) and other crystal orientations, SSP or DSP surfaces, and multiple thickness options.
View 300mm Silicon Wafers Available Online
300mm Silicon Wafers for Robot Handling and Equipment Training
Mechanical-grade 300mm wafers can be useful when researchers, semiconductor facilities, or training centers need full-size wafers for automated handling without requiring device-grade material.
A researcher requested:
UniversityWafer supplied:
300mm P-type mechanical-grade silicon wafers.
Reference #261445 for specifications and pricing.
For robot handling and equipment training, provide the required diameter, quantity, thickness, surface condition, and any other mechanical specifications. A device-grade wafer may not be necessary when the primary purpose is equipment setup or handling practice.
Buy 300mm Silicon Wafers
UniversityWafer can supply 300mm wafers in quantities ranging from individual research wafers to larger orders, depending on current inventory. If you do not see the specification you need online, send us your required diameter, grade, conductivity type, dopant, orientation, resistivity, thickness, polish, and quantity.
Get Your 300mm Silicon Wafer Quote FAST! Or, Buy Online and start researching today!
300mm Silicon Wafer Specifications
Selecting the correct 300mm substrate depends on the fabrication process or research application. Important specifications can include:
- Diameter: 300mm
- Growth method: Czochralski (CZ) or Float Zone (FZ)
- Conductivity: P-type, N-type, or undoped
- Dopant: Such as boron or phosphorus, depending on material
- Crystal orientation: Commonly (100), with other orientations available
- Resistivity: Depends on wafer type and application
- Thickness: Standard or custom/thinned options
- Surface: Single-side polished (SSP) or double-side polished (DSP)
- Geometry: TTV, bow, warp, and other dimensional requirements
Example 300mm CZ Silicon Wafer Specification
The following is an example of a 300mm silicon wafer specification that UniversityWafer has offered. Inventory and availability can change, so contact us for current specifications and pricing.
| Property | Specification |
|---|---|
| Diameter | 300 ± 0.2mm |
| Growth Method | CZ |
| Type / Dopant | P-type / Boron |
| Orientation | <100> ±1° |
| Notch Orientation | <110> ±1° |
| Resistivity | 1–100 Ω·cm |
| Thickness | >700µm |
| TTV | ≤10µm |
| Bow / Warp | ≤40µm |
| Surface | DSP |
| LPD | ≤50 @ ≥0.2µm |
Check Current 300mm Silicon Wafer Inventory
How Much Does a 300mm Silicon Wafer Weigh?
The weight of a 300mm silicon wafer depends primarily on its thickness. Using the approximate density of crystalline silicon, a full 300mm wafer with a thickness of about 775µm weighs approximately 128 grams. The exact mass varies slightly with wafer geometry, notch dimensions, and actual thickness.
Thinned 300mm wafers weigh less but become increasingly fragile as their thickness decreases. Proper wafer carriers and handling procedures are therefore especially important when transporting large-diameter, back-ground, or otherwise thinned substrates.
What Is 300mm in Inches?
A 300mm wafer has a diameter of approximately 11.81 inches and is commonly referred to in the semiconductor industry as a 12-inch wafer. The terms “300mm wafer” and “12-inch wafer” therefore generally refer to the same nominal wafer diameter.
What Is a 300mm Silicon Wafer?
A 300mm silicon wafer is a circular semiconductor substrate with a nominal diameter of 300 millimeters, or approximately 11.81 inches. For this reason, 300mm wafers are also commonly referred to as 12-inch silicon wafers.
Large-diameter silicon wafers are widely used in semiconductor manufacturing
because their greater surface area allows more dies to be fabricated during
a wafer-processing cycle. They are also used for equipment qualification,
process development, thin-film deposition, metrology, robotics training,
and semiconductor research.
UniversityWafer supplies 300mm silicon substrates with different grades, conductivity types, resistivities, crystal orientations, thicknesses, growth methods, and surface finishes.
Why Are 300mm Wafers Used in Semiconductor Manufacturing?
One major advantage of a 300mm wafer is its large usable surface area. A 300mm wafer has approximately 2.25 times the gross surface area of a 200mm wafer. This allows substantially more dies to be processed on a single wafer when the same die design and comparable edge exclusions are used.
Processing more dies per wafer can improve manufacturing productivity in high-volume semiconductor fabrication. However, 300mm manufacturing also requires equipment specifically designed for large-diameter wafer handling, processing, inspection, and automation.
Outside high-volume fabrication, researchers and equipment manufacturers also use 300mm wafers for process qualification, robot handling, deposition testing, metrology, and tool development.
300mm vs. 200mm Silicon Wafers
Both 200mm silicon wafers and 300mm wafers remain important semiconductor substrate sizes. A 200mm wafer has a nominal diameter of about 8 inches, while a 300mm wafer is commonly called a 12-inch wafer.
The larger 300mm diameter provides more wafer area and therefore the potential for more dies per processed wafer. However, wafer diameter alone does not determine device yield. Yield also depends on defect density, die dimensions, edge exclusion, process control, and device design.
What Specifications Matter for a 300mm Silicon Wafer?
The correct wafer depends on the fabrication process and application. Common specifications to consider include:
- Grade: Prime, Test, Mechanical, or Reclaim
- Growth Method: Czochralski (CZ) or Float Zone (FZ)
- Conductivity: P-type, N-type, or undoped
- Dopant: Such as boron or phosphorus
- Orientation: Commonly (100), with other orientations available
- Resistivity: Selected according to electrical requirements
- Thickness: Standard or custom-thinned wafers
- Polish: Single-side polished (SSP) or double-side polished (DSP)
- Geometry: TTV, bow, warp, notch orientation, and flatness
- Surface Requirements: Particle, roughness, and defect specifications when required
How Thick Is a 300mm Silicon Wafer?
A common nominal thickness for a standard 300mm silicon wafer is approximately 775µm, although the exact thickness and tolerance depend on the wafer specification.
Wafers can also be back-ground or polished to substantially lower thicknesses for applications requiring thin silicon substrates. As thickness decreases, however, the wafer becomes more flexible and fragile, making handling and transportation increasingly important.
UniversityWafer can help researchers source standard-thickness wafers as well as evaluate options for custom thinning and backgrinding.
300mm Silicon Wafer Grades
Prime Grade 300mm Wafers
Prime-grade wafers are intended for applications requiring tightly controlled substrate properties and high-quality polished surfaces. They are commonly selected for semiconductor fabrication and demanding research processes.
Test Grade 300mm Wafers
Test-grade silicon wafers can be used for process development, deposition experiments, equipment qualification, and other applications that may not require prime-grade material.
Mechanical Grade 300mm Wafers
Mechanical-grade wafers are useful for robot handling, equipment setup, training, mechanical testing, and applications where semiconductor device-grade material is unnecessary.
Reclaim 300mm Wafers
Reclaim wafers may provide another option for selected tool testing, process development, and non-critical applications. Suitability depends on the required surface and material specifications.
CZ vs. FZ 300mm Silicon Wafers
Most large-diameter silicon used in semiconductor manufacturing is produced using the Czochralski (CZ) crystal-growth method. CZ silicon is available across a wide range of electrical specifications and is commonly used for semiconductor fabrication.
Float Zone (FZ) silicon is valued for applications requiring very high resistivity and low oxygen content. Large-diameter FZ material is more specialized, so available specifications should be confirmed for each project.
One example of material previously offered by UniversityWafer is:
300mm FZ Silicon Wafer
Undoped
Resistivity: >750 Ω·cm
Thickness: 775 ± 25µm
Surface: DSP
What Are 300mm Silicon Wafers Used For?
Applications for 300mm silicon wafers include:
- Integrated circuit and semiconductor device fabrication
- Memory and logic device manufacturing
- CMOS process development
- Thin-film deposition research
- Photolithography and etching experiments
- Equipment qualification and process testing
- Wafer-handling robot training
- Metrology and inspection development
- Backgrinding and wafer-thinning research
- University and industrial semiconductor R&D
Thin-Film Deposition on 300mm Silicon Wafers
UniversityWafer can help researchers source 300mm silicon substrates for coated-wafer and thin-film applications. Depending on project requirements, available processes and structures may include:
- Thermal Oxide – Wet or dry thermal oxide layers on silicon.
- Silicon Nitride – Nitride films for semiconductor and materials research.
- Metal Films – Metal deposition for contacts, electrodes, thin-film experiments, and device-development applications.
Contact UniversityWafer with the required substrate specifications, film material, film thickness, deposition method, and quantity.
Backgrinding and Thinning 300mm Silicon Wafers
300mm silicon wafers can be mechanically thinned when a research or fabrication process requires a substrate below its original thickness. Backgrinding can reduce wafer thickness while controlling backside surface roughness according to project requirements.
A researcher previously asked UniversityWafer about reducing 12-inch wafers from approximately 750µm to about 300µm with backside roughness requirements of Ra <9nm and Rz <65nm.
UniversityWafer discussed a grinding/polishing process and specialized horizontal packaging for returning the thinner, more fragile wafers. The wafers can be separated with protective material and cushioned to reduce mechanical damage during shipment.
Example quoted specification:
12-inch wafer
Thickness: 300 ± 10µm
Ra: <9nm
Rz: <65nm
Grinding / Polish
How Many Chips Fit on a 300mm Wafer?
There is no single number of chips that can be produced from a 300mm wafer. The number depends primarily on the dimensions of each die and the usable wafer area.
Die count is also affected by edge exclusion, scribe lanes, die shape, process design, and wafer layout. Smaller dies allow more individual dies to fit on the same wafer, while larger processors and other complex devices produce fewer dies per wafer.
Actual manufacturing yield is different from the theoretical number of dies that physically fit on the wafer because defects and process variation can make some dies unusable.
Buy 300mm Silicon Wafers
UniversityWafer supplies 300mm silicon wafers for research, process development, equipment testing, semiconductor fabrication, and training. Depending on inventory, wafers may be available individually or in larger quantities.
When requesting a quote, provide the required grade, conductivity type, dopant, orientation, resistivity, thickness, polish, surface requirements, and quantity.
Related 300mm Silicon Wafer Resources
- Silicon Wafers – Explore silicon wafer grades, diameters, orientations, resistivities, dopants, thicknesses, and surface finishes.
- 200mm Silicon Wafers – Compare 200mm (8-inch) silicon substrates with larger 300mm wafers for research and semiconductor processing.
- Silicon Wafer Thickness Standards – Learn about standard silicon wafer thicknesses for different wafer diameters, including 300mm substrates.
- Silicon Wafer Orientation – Understand common silicon crystal orientations such as (100), (110), and (111).
- Float Zone (FZ) Silicon Wafers – Learn about high-resistivity and low-oxygen Float Zone silicon for specialized semiconductor research.
- Mechanical Grade Silicon Wafers – Explore wafers for equipment testing, robot handling, training, and other non-device applications.
- Test Grade Silicon Wafers – Find test-grade substrates for process development, deposition experiments, and equipment qualification.
- Silicon Wafer Dicing – Learn about silicon wafer dicing, die preparation, and wafer cutting services.
- Silicon Wafer Notches – Learn how wafer notches are used to identify and orient large-diameter silicon substrates.
- Silicon Wafer Thickness Range – Explore standard and custom silicon wafer thickness options, including thinned substrates.