Vacuum Thin-Film Depositon

University Wafer Silicon Wafers and Semicondcutor Substrates Services
University Silicon Wafer for Production

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We understand how important quality is to you. Our sputter process has been designed to deposit ultra-clean metal and dielectric films. All wafer processing, including metal deposition, is performed inside our class 100 clean-room. An in-situ RF etch is added to the process to insure good film adhesion and ohmic contact to underlying conductive layers.


In addition to an In-situ RF etch, we can provide an HF-dip just prior to sputtering aluminum and aluminum alloy films. Adding this additional step can further increase ohmic contact between layers.


Sputtered metal deposition is an omni-directional process. For this reason, sputter deposition is not a good candidate for Lift-Off processing. If you are interested in metal for Lift-Off processing please see our E-beam evaporation metals page.


All sputter films are available on silicon wafers sizes up to 300mm in diameter. We can also provide sputtered films on non-silicon materials, including quartz and glass wafers.

We offer a wide variety of sputtered non-precious metals, dielectric films, and silicon. Precious metals are available for E-Beam evaporation.

Item Target
High purity Gold (Au) Target Purity 4N Hight Purity Gold Sputtering Target
High purity Silver (Ag) Target Purity 4N High Purity Siliver Sputtering Target
High purity Platinum (Pt) Target Purity:3N5 and 4N High Purity Platinum Sputtering Target Pt
High purity Aluminum (Al) Target Purity 4N, 5N and 5N5 High Purity Aluminum Sputtering Target Al
High purity Copper (Cu) Target 4N5 and 6N High Purity Copper Sputtering Target Cu
Item Target
High purity Titanium (Ti) Target Purity: 2N7 and 4N5 Titanium Sputtering Target
High purity Nickel (Ni) Target Purity: 3N5 and 4N5 Hight Purity Nickel Sputtering Target
High purity Tantalum (Ta) Target Purity: 3N5 and 4N5 High Purity Sputtering Target Ta
High purity Tungsten (W) Target Purity: 3N5 High Purity Tungsten Sputtering Targets (W)
Molybdenum (Mo) Target Purity: 3N5 Hight Purity Molybdenum Sputtering Target Mo)
Item Target
High purity Silicon (Si) Target Purity: 4N, 5N and 6N High Purity Silicon Sputtering Target
High purity Graphite (C) Target Purity: 4N and 5N High Purity Graphite Sputtering Target
High purity Chromium (Cr) Target Purity: 3N5 and 3N8 High Purity Chromium Sputtering Target
Magnesium (Mg) Target Purity: 3N5 High Purity Magnesium Sputtering Target (Mg)
Germanium (Ge) Target Purity: 5N and 6N High Purity Germanium Sputtering Target (Ge)