Sputtering Targets for Research & Production

university wafer substrates

What does a Sputtering Target Look Like?

Sputter targets are commonly rectangular or circula. Other shapes can also be produced. For example Gold (Au) sputting targets can be made in different shapes and even be oddly shaped depending on the type of thin layers to be produced. Typically, the heterogeneity of these sputter targets results in a "sputterfilm" that does not have the uniformity desired for most semiconductor and photoelectric applications.

sputtering targets shape and sizes

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The sputtering target market is driven by the increasing demand worldwide and is therefore a key driver for the development and development of new technologies in the glass industry. Manufacturers use sintering technology such as sintered glass and deeply processed glass to produce their increased sputtering targets. Some companies, in particular deep-glass companies and glass manufacturers, are concentrating on expanding their coated glass production lines. [Sources: 6, 9]

The target market for sputter products can be divided into three main categories depending on the material: glass, glass products and glass components. These products include sputtering and sputtering targets as well as their components and their applications in the glass industry. [Sources: 2, 6]

In some cases, manufacturers will create segmented targets linked by special joints, but some sputtering plants will require larger sputtering targets. The most important metals used in the production of conductive layers are: AEM deposition, which forms a barrier layer between the surface of the target material and the conductive layer (the material itself). These are used as barrier layers and include a range of target materials used for coatings and industrial tools. They can also be embedded with a variety of other materials such as ceramics, polymers, metals, plastics and other metals. [Sources: 0, 3, 8]

In many cases, used or scrapped tantalum targets are not used directly by tantalum metal producers to produce new ingots or blanks for stuttering target producers, but by scrap traders, particularly Exotech, which pays prices for their use. For this reason, the price paid by the manufacturer of a sputter target for a used TantAlum target is higher than the price paid for Tant aluminium scrap by a sputter target manufacturer. The high prices of Tant Alu are therefore paid for the tantalum targets used by their scrap buyers such as Ex techo, and also for the higher prices of the targets themselves, where they are used as ore substitutes. [Sources: 13]

In order to deposit a film with high integrity during reactive sputtering, low-oxygen metal powders are required, which consist of metal powder produced by other metal parts. Sputtering targets are relatively expensive to make precious metals electrophile, requiring several refining steps. [Sources: 7, 10, 12]

Proper processing can produce powders that meet the tantalum of a sputtering target that has a higher electrical conductivity than the ingot in which it is located. Sputting targets are thin layers that are grown from material by sputtering. They are used in the production of high-performance electronics, electronic components and other materials. These targets can be manufactured by processing metals and ceramics or used for other purposes, such as the manufacture of electronic components. [Sources: 3, 7, 11]

As mentioned above, two types of targets are used, with the magnetron sputtering method used for TCO separation and cold spraying. Cr - CrO 2 targets have traditionally been used to form black matrices for flat panel displays that have no health or environmental concerns. Cold spraying is also used in some cases to coat large areas, as the sputtering targets currently used, which are formed using conventional manufacturing methods, tend to be too small for many applications. Moreover, most sputtering target materials are metallic elements and alloys, although there are ceramic targets that produce thin coatings hardened with various tools. [Sources: 1, 4, 8]

[Sources: 1, 8, 9]

The thickness of the target carrier material can be the appropriate thickness used to form the sputtering target. SputterTargets and carrier plates can also be used in a variety of other applications such as semiconductor and photoelectric applications. There are a number of different types of carrier targets that can be used to produce sputter targets and other materials. [Sources: 7]

The powder used to produce the resulting metallurgical article may have a purity vis-à-vis the metal. The ions used for bombarding the sputterer are also embedded with MoO 3 films, which generate reactive sputtering (Mo) in the target. This creates a decent thin film and a very high degree of purity of the material. [Sources: 1, 7, 8]

Molybdenum sputter targets are a competent area in the coating industry in terms of precise coating during sputtering. There is a wide range of applications for sputtertargets, but the most common applications range from high-performance coatings for industrial applications to the production of high-quality ceramics and other materials for the automotive industry. [Sources: 5, 9]

The growing demand for stuttering targets and the increasing use of high-performance electronics in the automotive industry have boosted APAC's targeted market revenues. The growth of integrated circuits and other advanced technologies such as smartphones and tablets has created an inflow of demand for the stuttering Asia-Pacific targeting market. [Sources: 9]

 

Sputtering Targets

Below are just some of the sputtering targets that we have: 

 Item

Specification

 Quantity

 

1

CST-01-Cobalt Sputtering target

Cobalt (Co),Purity:99.95%:Diameter: 1inch, thickness: 0.125inch

 

1 No.

 

2

AKN-NiFe-Ni80Fe20

Ni80Fe20 sputter target,Purity:99.95%:Diameter: 2inch, thickness: 0.125inch

 

1 No.

 

3

AKN-NiFe-Oneinch-Ni80Fe20 Ni80Fe20 sputter target,Purity:99.95%:Diameter: 1inch,

thickness: 0.125inch

 

1 No.

 

 

4

AKN-WS2-WS2

Ws2 sputter target,Purity:99.9%:Diameter: 1inch, thickness: 0.125inch, with Cu backing

plate

 

 

1 No.

 

 

5

AKN-Gd2O3-Gd2O3

Gd2O3 sputter target,Purity:99.9%:Diameter: 1inch, thickness: 0.125inch, With Cu backing

plate

 

 

1 No.