SIMOX Silicon on Insulator (SOI) Wafers Thin Device Layer

What is SIMOX Silicon-on-Insulator (SOI) Tech?

SIMOX SOI technology is a type of semiconductor-based on the buried oxide film. It is highly selective and allows certain energy states. SIMOX devices have several properties that make them suitable for use in mainstream IC technology. The most important one is the level of selectivity. The silicon-on-insulator (SOI) layer is important for the release of electrons. Other factors affecting the device include the oxide film thickness and the thickness of the silicon layer.

SIMOX represents a significant breakthrough in thermal expansion. SIMOX stands for Single- Molecule Oxygen Complex and is made from pure silicon on insulator. The silicon on insulator forms a semi-solid layer upon which a powder of tungsten carbide is bonded. SIMOX has unique abilities to expand to very large dimensions, up to ten times its initial volume. This property makes SIMOX very useful for use in applications requiring high temperature expansion.

The technology is ideal for microsystems applications, as it is a safe, non-invasive micro-implant procedure. The process uses an injection gun for silicon ion implantation. The process also utilizes a smart cut, which enables soiled dressings to be inserted into the implant. This allows for a minimally invasive procedure with a higher rate of success. This new material can be used in a variety of RF devices, including medical equipment.

SIMOX Silicon-on-Insulator-Inventory

Below are just some fo the thin device layer SOI that we sell online.

If you don't see a spec that you can use, please fill out the form for an immediate quote.

What is SIMOX Silicon-on-Insulator (SOI)

SIMOX is ideal for use in the surgical industry in that it offers a safe, non-invasive way of implanting micro implants directly into the body. Micro implantation is an essential part of the minimally invasive procedure, and it is performed through a specially adapted injection gun. One of the benefits of the SIMOX process smart cut is that it allows for the use of soiled dressings to be inserted into the implants, as opposed to traditional dressings used prior to the procedure. This is made possible through the use of soi wafers, which have been designed to insert into the silicon based micro implant. Once the wafer is adhered to the silicon layer within the implant, the dressings are removed and the micro implant is then inserted into the body.

In addition to the use of soi wafers for inserting and removal of the dressings, SIMOX uses a novel silicon on insulator technique. This technique is not commonly used in other applications, but is especially useful for use in the manufacturing industry. The silicon on insulator technique is like a molecular model of the human skin in that it mimics the natural insulating layer found on the surface of the skin. Because of this, the surface tension of the silicon based material is less than that of natural silicon, which reduces the resistance of the material and allows for it to be placed more easily and with greater precision. As a result, it allows for greater precision and control when working with materials, such as solid polymers and polyurethane. It also allows for the incorporation of micro-fabricated parts into otherwise difficult to work with components.

SIMOX's goal is to create a fully-functional miniature electronic device out of a semi-conductor material such as silicon, tantalum and gallium arsenide. The device would contain a high-level source of power (lowered via a microchip), and would contain multiple conductors in the form of diodes or semiconductors. The device could be programmed to perform a variety of different functions, depending on the type of micro circuitry that was used to design the device in the first place.

The wafer bonding process that makes SIMOX unique is accomplished by using an innovative technique called wafer bonding. The procedure involves placing the wafer material directly onto the surface of the silicon semiconductor layer, which then allows for the electronic layer to be bonded directly to the wafer. This is a unique way to layer the wafers without using the traditional oxide layer which can be bonded using several oxides. Instead, this is a method where only the topmost layer of wafers is used in order to provide the very highest level of uniformity. In fact, because there is no oxide layer involved, the wafer bonding process allows for greater purity and stability compared to other similar processes.

The wafer bonding process also involves a second Si layer which is used to create a barrier between the silicon and the gate. This creates a second barrier of insulator which allows for the gate to be open at all times. One benefit of the silicon-on-insulator layer is that the gate can be opened more quickly compared to other methods of opening it. In addition, the insulator layer provides an additional level of durability to the device, as it can provide sufficient energy to the silicon during charging and discharging. Another advantage of the silicon-on-insulator layer is that it allows for a transfer of energy across the device from the source silicon to the device, while still protecting the device from over current or power surges.

The SIMOX substrate has a very high level of selectivity, as it only allows the transfer of certain energy states. For instance, the silicon-on-insulator and the oxide layer thickness can determine whether or not the device can accept or release electrons. In fact, the oxide layer thickness can determine how stable the device is, as it is the thickness of the oxide film that determines how quickly charge and discharge currents are present. However, the substrate can also affect the device's stability, as the amount of charge carriers present can affect the device's behavior when placed in a magnetic field.

The final step in the fabrication process is the soiling or scuffing of the silicon wafer. During this step, the surface of the silicon wafer is coated with small amounts of metallic substances such as copper, cobalt, or tin. These metallic substances are used to create a physical barrier, which prevents the electrical current from flowing between the silicon and the electrode. However, the conductivity of the silicon can be increased by the addition of the sulfur compound, which increases the number of conductive sites.

Comparing SOI Wafers: 150mm vs 200mm

Silicon-on-Insulator (SOI) technology has made big improvements in how computer chips work and save energy. At University Wafer, we provide high-quality SOI wafers for many uses. Let's look at two popular sizes of SOI wafers: 150mm and 200mm. We'll explore what makes them special, their good points, and how they're used in making modern computer chips.

What are SOI Wafers?

SOI wafers have a thin layer of silicon on top of an insulating material, usually silicon dioxide. This special structure makes them better than regular silicon wafers. They reduce electrical losses and help devices work better. The insulating layer acts like a barrier, cutting down on electrical problems and making the overall device perform better. This structure allows for faster, more power-saving chips that are important for advanced uses in many areas, from cell phones to car electronics.

Key Differences: 150mm vs 200mm SOI Wafers

150mm SOI Wafers: The Versatile Option

150mm SOI wafers have been important in the computer chip industry since 1983. They're still widely used today, especially for special applications and smaller production runs. They're still relevant because they're versatile and cost-effective for certain types of manufacturing.

Advantages of 150mm SOI Wafers:

150mm SOI wafers are cost-effective for small to medium production runs, making them great for research and startups. They work with a lot of older equipment, which means companies can keep using their existing machines. They're ideal for specialized uses, particularly in aerospace and defense. They need less initial investment, which helps smaller operations innovate. They allow for faster prototyping and small-batch production, which is crucial for quick development. They're good for analog and mixed-signal devices where the newest technology isn't always needed. They offer a good balance between cost and performance for many mature technologies.

200mm SOI Wafers: The Powerhouse

200mm SOI wafers are becoming more common in modern chip manufacturing. They offer better capabilities and efficiency compared to 150mm wafers. These larger wafers are leading the way in many advanced computer chip applications, driving new developments in fast computing, 5G technologies, and artificial intelligence.

Advantages of 200mm SOI Wafers:

200mm wafers produce more chips per wafer (about 78% more usable area than 150mm), which greatly improves production efficiency. They have better uniformity across the surface, which is crucial for advanced manufacturing and complex chip designs. They work better with modern manufacturing equipment, allowing for more advanced processes. They're more cost-effective for making lots of chips due to economies of scale. They're better for making larger, more complex chip designs, which is essential for cutting-edge applications. They're more suited for advanced manufacturing below 28nm, enabling the production of high-performance, energy-efficient devices. They support putting more functions on a single chip, helping develop all-in-one chip solutions.

Manufacturing Considerations

When comparing 150mm and 200mm SOI wafers, it's important to understand how they're made, as this affects their quality and suitability for different uses. These factors play a big role in determining the overall cost, performance, and reliability of the final computer chips.

Wafer Thinning Capabilities:

Both 150mm and 200mm SOI wafers can be made very thin, which is important for many advanced applications. However, there are some differences in how thin they can be made and what happens when they are:

• 150mm wafers can usually be made as thin as 25 microns, which works well for many flexible electronics
• 200mm wafers can be made just as thin but need more careful control during the process because they're bigger
• 200mm wafers are more even across larger areas when thinned, which is important for big, complex circuits
• When making both sizes very thin, manufacturers have to be careful not to warp or break the wafers
• Advanced thinning techniques like grinding and polishing are used to make the wafers ultra-thin
• Choosing between 150mm and 200mm for ultra-thin applications often depends on what the specific device needs and what the manufacturer can do

Surface Quality and Uniformity:

The quality and evenness of the surface are very important when making SOI wafers. These factors directly affect how well the devices work and how many good chips you can make. The larger size of 200mm wafers presents both challenges and opportunities:

• 200mm wafers generally have better overall evenness due to improved manufacturing processes
• Larger wafers are more affected by problems at the edges, so manufacturers have to be extra careful
• Advanced flattening techniques are crucial for keeping the surface flat, especially for 200mm wafers
• Both sizes benefit from state-of-the-art polishing methods to make the surfaces extremely smooth
• Quality control, like automated defect checking, is more important for 200mm wafers because there's more area to check

The image above shows wafer warpage, which is a big problem in keeping the surface quality and evenness good, especially as wafers get bigger. Managing warpage is important for both 150mm and 200mm wafers, but it's harder with larger wafers.

Applications of 150mm and 200mm SOI Wafers

Both 150mm and 200mm SOI wafers are used in many different fields, each with its own advantages. The choice between these two sizes often depends on what the application needs, what manufacturing capabilities are available, and economic factors.

Microprocessors and RF Devices:

SOI technology has made big improvements in microprocessors and radio frequency (RF) devices, with both 150mm and 200mm wafers playing important roles:

• 150mm: Still used in some specialized or older processor designs, particularly for industrial control systems and car electronics
• 150mm: Good for RF parts in older mobile devices and Wi-Fi systems
• 200mm: Widely used for modern, high-performance processors in personal computers, servers, and advanced mobile devices
• 200mm: Preferred for complex RF circuits in 5G infrastructure, advanced radar systems, and high-frequency trading applications
• 200mm: Allows for combining RF, analog, and digital functions on a single chip for advanced communication systems

Power Electronics:

The power electronics sector has seen big benefits from SOI technology, with both wafer sizes finding important uses:

• 150mm: Commonly used in car power management systems and medium-power industrial controls
• 150mm: Well-suited for separate power devices and integrated circuits in consumer electronics
• 200mm: Preferred for high-power applications in electric vehicles, including power inverters and battery management systems
• 200mm: Used in advanced renewable energy systems, such as solar inverters and wind turbine controls
• 200mm: Enables the development of more efficient and compact power conversion devices for data centers and telecommunications infrastructure

Photonics and Specialized Applications:

SOI technology has opened up new possibilities in the field of photonics and various specialized applications, with both 150mm and 200mm wafers contributing to innovations:

• 150mm: Used in making optical modulators and waveguides for telecommunications
• 150mm: Suitable for specialized sensors in aerospace and defense applications
• 200mm: Enables combining photonic components with electronic circuits for advanced data communication systems
• 200mm: Used in developing silicon photonics for next-generation computing and quantum technologies
• 200mm: Supports the creation of high-performance MEMS devices for automotive, consumer electronics, and medical applications

The image above shows phase shift lithography, a technique often used in making advanced SOI-based devices. It shows how precise the manufacturing needs to be for these special applications. This advanced method is particularly important for 200mm wafers, allowing the creation of smaller features and more complex structures essential for cutting-edge photonics and specialized semiconductor devices.

Choosing the Right SOI Wafer for Your Application

When picking between 150mm and 200mm SOI wafers, think about these factors to make sure you choose the best option for what you need:

• How many you need to make: 200mm is usually cheaper for making lots of chips, while 150mm might be better for smaller amounts
• How complex your device is: More complex designs with smaller parts usually work better with 200mm wafers
• What equipment you have: Make sure your manufacturing facilities can work with the wafer size you choose
• Cost: Think about both the initial cost and long-term production costs for each wafer size
• What performance you need: Some applications might work better with either 150mm or 200mm wafers
• Future growth: Consider if you might need to make more in the future, which might make 200mm a better choice for long-term growth
• Supply availability: Check how easy it is to get both wafer sizes in your area
• Heat management: Larger wafers might be harder to keep cool for some high-power applications

At University Wafer, our team is always ready to help you pick the best SOI wafer for what you're doing. We can give you detailed advice on the good and bad points of each wafer size for your specific use, helping you make a smart choice that fits your technical and economic needs.

Conclusion: The Future of SOI Wafers

As technology keeps advancing, we're seeing a gradual shift towards 200mm wafers in many applications. This is because they're bigger and work better with more advanced manufacturing processes. This trend is driven by the increasing need for better performance, more integration, and improved energy efficiency in semiconductor devices. However, 150mm wafers are still important, especially in specialized or older applications where switching to larger wafers might not be necessary or cost-effective.

Choosing between 150mm and 200mm SOI wafers depends on what you need and what manufacturing capabilities you have. Both sizes are crucial in different parts of the semiconductor industry, driving innovation and enabling the development of cutting-edge technologies. As the industry continues to evolve, we might see even more advancements in SOI technology, possibly including even larger wafer sizes or new manufacturing techniques that could change how semiconductors are produced.

Whether you're working on microprocessors, RF devices, power electronics, or exploring new areas in photonics, University Wafer is here to support your research and production needs with our high-quality SOI wafers and expert guidance. We're committed to innovation and quality, ensuring you have access to the latest advancements in SOI technology, no matter which wafer size you choose. As the semiconductor industry continues to push the boundaries of what's possible, SOI wafers will undoubtedly play a key role in shaping the future of electronics and technology.