Reclaimed Silicon Wafers
We have a large selection of inexpensive reclaimed silicon wafers. Please send let us know what specs/qty you need and see how much you can save over higher grade silicon substrates.
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Why Reclaim Silicon Wafers?
Reclaiming silicon wafers offers a range of economic, environmental, and operational benefits, especially in semiconductor manufacturing, R&D, and equipment testing. Here's a breakdown of why it's done:
💰 1. Cost Savings
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Reclaimed wafers cost 60–90% less than virgin (prime-grade) wafers.
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Ideal for non-device applications like process monitoring, training, or calibration.
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Extends the usable life of expensive wafers that would otherwise be discarded.
🌱 2. Environmental Sustainability
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Reduces waste and conserves natural resources (like ultra-pure silicon and energy-intensive processes).
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Minimizes the carbon footprint associated with wafer manufacturing.
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Supports green manufacturing and circular economy initiatives.
⚙️ 3. Support for Equipment and Process Validation
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Used for:
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Etching and deposition tests
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CMP (chemical-mechanical polishing) process tuning
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Tool qualification and calibration
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Avoids using costly virgin wafers for routine checks or trial runs.
🧪 4. Training and R&D Applications
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Perfect for:
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University labs
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Cleanroom practice and protocol training
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Prototype development and failure analysis
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Reduces the financial barrier for academic or early-stage research projects.
🔁 5. Reusable Substrate Material
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Can be stripped, ground, and polished multiple times depending on thickness and defect level.
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Allows reuse of otherwise scrap wafers for monitoring or test lots.
⚠️ Limitations to Keep in Mind
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Surface quality may not meet device-grade standards.
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May contain scratches, chips, or prior process residues.
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Not suitable for high-yield production or advanced node fabrication.
| Feature | Prime Wafers | Test Wafers | Reclaimed Wafers |
|---|---|---|---|
| Surface Quality | Ultra-smooth, defect-free | Minor imperfections acceptable | May have scratches or chips |
| Thickness Uniformity | Tight control (e.g., ±0.5 µm) | Moderate tolerance | Less consistent |
| Flatness (TTV) | Very flat (low TTV) | Moderate flatness | Lower flatness |
| Polish Type | SSP or DSP | Usually SSP | Typically SSP, DSP available |
| Electrical Grade | Device-quality | Non-device use | Not suitable for electronics |
| Cleanroom Use | Class 1 compatible | Class 10–1000 | May not meet cleanroom spec |
| Applications | ICs, MEMS, photonics | Tool testing, R&D | Training, etch trials, monitor |
| Cost | High $$$ | Medium $$ | Low $ |
| Reuse Potential | Often single-use | Sometimes reusable | Can be reclaimed multiple times |
| Typical Buyers | Foundries, fabs, medical | Process engineers, labs | Universities, equipment OEMs |
What Is Silicon Wafer Reclaim?
Silicon wafer reclaim is the process of recycling used silicon wafers—typically from semiconductor manufacturing or testing—by removing existing layers and polishing the wafer so it can be reused for non-critical applications.
🔁 Key Steps in the Silicon Wafer Reclaim Process:
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Strip and Clean: Removal of films, photoresist, or metal layers using chemical solutions (e.g., HF, H₂SO₄, H₂O₂).
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Surface Grinding: Grinding down the surface to remove deep defects or contamination.
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Polishing: Chemical mechanical polishing (CMP) restores wafer flatness and surface quality.
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Inspection: Wafers are examined for defects, thickness, resistivity, and flatness.
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Repackaging: Reclaimed wafers are sorted and repackaged for reuse.
🎯 Typical Uses for Reclaimed Wafers:
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Equipment calibration
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Process monitoring
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Training and R&D
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Etch or deposition testing
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Non-device-level prototyping
✅ Benefits:
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Cost savings vs. virgin wafers
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Environmental sustainability
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Efficient resource utilization
⚠️ Limitations:
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Not typically suitable for high-yield, advanced device fabrication.
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Slightly lower surface quality and more variation than prime-grade wafers.
Let us know if you would like help sourcing reclaimed wafers or listing specific specs (e.g., diameter, thickness, resistivity)?
Key Specifications for Reclaimed Silicon Wafers
| Parameter | Options/Range | Notes |
|---|---|---|
| Diameter | 100 mm (4"), 150 mm (6"), 200 mm (8"), 300 mm (12") | Choose based on your equipment compatibility |
| Thickness | Typically 500–800 µm (depends on grinding stage) | May vary more than with virgin wafers |
| Type | n-type or p-type | Often unspecified if for non-critical use |
| Dopant | Phosphorus (n-type), Boron (p-type) | For test purposes, dopant may not matter |
| Orientation | <100>, <111>, etc. | <100> is most common for test wafers |
| Surface | Single-side polished (SSP) or Double-side polished (DSP) | DSP costs more but is flatter |
| Grade | Reclaimed/Test/Monitor Grade | Not for production, but fine for metrology, training, or process tests |
| Cleanliness | Particle spec, oxide removed, etc. | Depends on reclaim level |
📦 Example Reclaimed Wafers from UniversityWafer (for reference)
| ID | Diameter | Type | Dopant | Orient | Thickness | Polish | Notes |
|---|---|---|---|---|---|---|---|
| A0494 | 100 mm | p-type | B | <100> | 3000 µm | SSP | Reclaimed, scratched, for SEMI TEST |
| B1079 | 100 mm | p-type | B | <100> | 3000 µm | SSP | Reclaimed, with chips/scratches |
| A1075 | 100 mm | p-type | B | <100> | 2950 ±50 µm | DSP | Reclaimed, minor defects |