Sputtering Targets

University Wafer Silicon Wafers and Semicondcutor Substrates Services
University Silicon Wafer for Production

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Deposition materials presently in our inventory, or which we are able to produce by reactive processes, include the following:

Sputtered films:

Ag, Al, Al-1%Si, Al2O3, Au, Co-80%Cr, Cr, Cu, Fe, Ge, Mo, Nb, Ni, Ni-20%Cr, Ni-7%V, Pt, Si, SiC, Si3N4, SiO2, Ta, TaN, TaSi2, Ta5Si3, Ti, TiN, TiO2, Ti-90%W, W, WN, WSi2.

This list can be enlarged as targets are purchased.


Metal Sputtering Service

We provide Metal Film Deposition in small and large quantities.

Our metal film deposition is free of clamp marks and we have the capability to process any wafer size up to 300mm with a +/-5% uniformity. Our metal film deposition service includes single layer and/or the combination of the following elements:

Ta, TaN, Cu, Ti, TiN, Al, Al-Si-Cu, Al-Cu, Al-Si, TiW, W, WN, WSi, and Cr.