UniversityWafer provides precision sputtering services for silicon wafers, glass, sapphire, quartz, ceramics, and customer-supplied substrates. Our vacuum sputter deposition capabilities support research and production applications requiring conductive metals, dielectric coatings, nitrides, oxides, and custom thin films with excellent adhesion, uniformity, and repeatability. :contentReference[oaicite:0]{index=0}
UniversityWafer provides precision sputtering services for universities, research laboratories, semiconductor manufacturers, and technology companies developing advanced electronic, photonic, MEMS, and optoelectronic devices. Our Physical Vapor Deposition (PVD) processes produce high-quality thin films with excellent adhesion, uniformity, and repeatability across a wide variety of substrate materials.
Whether you require a single conductive metal layer, a dielectric coating, or a custom multilayer thin-film stack, our engineering team can recommend the appropriate deposition process, target material, film thickness, and substrate preparation to meet your project's performance requirements.
"Our research group is fabricating MEMS pressure sensors and requires RF magnetron sputtering of a 200 nm platinum thin film over a 20 nm titanium adhesion layer on 100 mm silicon wafers. Can you provide film thickness uniformity, substrate preparation options, expected lead time, and pricing for prototype quantities?"
Our sputtered thin films support research and manufacturing in microelectronics, MEMS fabrication, photonic devices, optical coatings, biosensors, semiconductor packaging, quantum devices, power electronics, solar cells, RF components, and advanced materials development.
Complete the quotation form with your substrate material, wafer diameter, target material, desired film thickness, deposition method, quantity, and any special processing requirements. Our thin-film specialists will respond quickly with technical recommendations and a competitive quotation.
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Sputtering is a Physical Vapor Deposition (PVD) process used to deposit thin films of metals, dielectrics, alloys, and semiconductor materials onto a substrate. During sputtering, energetic ions strike a solid target, ejecting atoms that condense on the substrate to form a uniform, highly adherent coating. The process provides excellent film thickness control, repeatability, and material purity, making it one of the most widely used deposition techniques in semiconductor manufacturing and advanced materials research.
UniversityWafer offers custom sputtering services for silicon wafers, glass, quartz, sapphire, ceramics, and other research substrates. Whether your project requires a single conductive layer or a complex multilayer stack, our engineering team can tailor the deposition process to meet your exact specifications.
| Process | Advantages | Typical Applications |
|---|---|---|
| DC Magnetron Sputtering | High deposition rates for electrically conductive materials with excellent film uniformity. | Metal contacts, seed layers, electrodes, and semiconductor metallization. |
| RF Magnetron Sputtering | Ideal for insulating materials and dielectric coatings while maintaining excellent thickness control. | Oxides, nitrides, optical coatings, MEMS, and photonic devices. |
| Reactive Sputtering | Forms compound films by introducing reactive gases during deposition. | Silicon nitride, metal oxides, transparent conductive films, and protective coatings. |
UniversityWafer can deposit a wide variety of thin-film materials for research and commercial applications, including:
Sputtered coatings are widely used because they provide dense, durable, and high-purity films suitable for demanding research and manufacturing environments.
Our sputtering services are available for prototype development through production-scale manufacturing. We work closely with researchers and engineers to optimize film composition, thickness, adhesion, uniformity, and substrate compatibility for each application. Whether you need a simple metal coating or a sophisticated multilayer thin-film structure, UniversityWafer can provide a custom deposition solution designed to meet your technical requirements with fast turnaround and consistent quality.