Custom silicon discs are used in semiconductor research, PLD thin-film deposition, MEMS fabrication, X-ray applications, silicon dies, and advanced laboratory experiments. UniversityWafer supplies high-purity silicon discs in custom diameters, thicknesses, crystal orientations, and CMP-polished surface finishes for research and production applications.
Researchers commonly use custom silicon wafers and silicon discs as targets for Pulsed Laser Deposition (PLD) experiments, thin-film deposition, semiconductor coating research, and advanced materials science applications. Silicon PLD targets can be fabricated in custom diameters, thicknesses, crystal orientations, resistivities, and surface finishes depending on the deposition system requirements.
A research laboratory manager requested the following custom silicon disc specifications for PLD target applications:
“You have sent us the quotation for the wafers which will be used as substrates in the PLD experiments, and now we are looking for a silicon disc which will be used as a target.”
“We also need a thicker wafer. Could you possibly replace one item with a 200 mm P/B (110) silicon wafer with 1450–1530 µm thickness and send us the updated quotation?”
Researchers often request thicker silicon substrates for PLD target fabrication because they provide improved durability and thermal stability during high-energy deposition processes.
Reference #167812 for specifications and pricing.
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Custom silicon discs and silicon dies are frequently used in semiconductor processing, forming applications, MEMS fabrication, optics, and materials science experiments. Researchers may request thicker silicon components when electronic properties are less important than mechanical stability, dimensional precision, or polished surface quality.
A graduate student requested the following custom silicon die specifications:
“The electronic specifications of the silicon are not critical because I want to use silicon as a die for forming. I only need silicon material with more than 1 mm thickness and 3 to 5 mm diameter.”
“Do you have this type of silicon disc and what would the pricing be?”
UniversityWafer, Inc. quoted a custom-fabricated silicon die using precision silicon rod material and a (CMP) polishing process for improved surface quality and dimensional consistency.
Certificate #PO-6700 for CMP process capability was available upon request.
Reference #188174 for specifications and pricing.
A silicon disc is a circular silicon component commonly fabricated from high-purity silicon wafers for semiconductor research, thin-film deposition, MEMS fabrication, X-ray shielding, photonics, and laboratory experiments. Silicon discs can be manufactured in custom diameters, thicknesses, crystal orientations, doping types, and surface finishes depending on the application requirements.
Unlike silicone, which is a rubber-like polymer material, silicon is a semiconductor material widely used in integrated circuits, sensors, power electronics, and advanced microfabrication technologies. Silicon discs are commonly used as PLD targets, silicon dies, vacuum deposition substrates, optical components, and precision semiconductor parts.
Researchers frequently request custom silicon discs with:
High-purity intrinsic silicon discs are frequently used in X-ray shielding research, semiconductor instrumentation, optics, and laboratory testing applications. Researchers may request undoped silicon material because it provides consistent material properties and high purity for scientific experiments.
A doctoral research group requested the following custom silicon disc specifications for an X-ray shielding application:
“We are looking for pure silicon wafer material, no dopant, with 0.050" thickness. We are making these into 1.870" +.000" / -.010" diameter discs for use in an X-ray application.”
“Our customer stated a pure silicon, no dopant material requirement. They are using the silicon discs along with Fe and Sn discs to shield X-rays.”
“Initial quantities would be 5–10 pieces, with projected production volumes of 20–50 discs per month.”
The requested custom silicon disc specifications included:
UniversityWafer, Inc. quoted custom-fabricated pure silicon discs manufactured from high-purity silicon wafer material for the X-ray shielding research application.
Reference #255375 for specifications and pricing.
A silicon disc is a circular silicon component used in semiconductor fabrication, thin-film deposition, MEMS devices, X-ray applications, optics, and laboratory research.
Silicon discs are used for PLD targets, semiconductor dies, vacuum deposition systems, MEMS devices, X-ray shielding, and advanced semiconductor research applications.
Yes. Silicon discs can be manufactured in custom diameters, thicknesses, crystal orientations, doping types, and surface finishes depending on the application requirements.
Common surface finishes include SSP, DSP, and CMP-polished silicon surfaces.
UniversityWafer supplies custom silicon discs, silicon dies, CMP-polished silicon wafers, PLD targets, and pure silicon materials for semiconductor research, X-ray applications, MEMS devices, and advanced laboratory experiments.
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