A PhD student requested a quote for the following.
Would it be possible to provide an price estimate for:
Reference #321507 for specs and pricing.
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A graduate student requested the following quote.
I am interested in using a low or room temperature bonding process to join a piezo disc actuator onto a ULE glass substrate. The disc actuator is of PZT-5H or PZT-5A (or LiNbO3) material, about 15 mm in diameter and 1.2 mm thick with a coaxial electrode Au coating. I'd like to prove the concept of using such a process, so would like to bond a single actuator onto a 100 mm diameter, 10 mm thick ULE substrate (with an Au pattern for the actuator).
Do you think this is possible with one of your processes?
Reference #322584 for specs and pricing.
A hardware engineer requested a quote for the following.
Do you sell Lithium Niobate piezo actuators or just the raw material? We are trying to find a source for Lithium Niobate to be used in the 150 MHz + frequency range.
Reference #292605 for specs and pricing.
An assitant professor at a large university requested a quote for the following.
Our lab is focused on MEMS devices. We usually use silicon and glass wafers for fabricating sensors and actuators.
We are currently looking for low resistivity (0.001-0.005 Ohm.cm) 4" silicon prime wafers, with 1µm of wet thermal oxide on both sides, similar to item 1583 in your catalog. But in our case, we would rather to have a DSP silicon wafers (instead of the SSP silicon wafers of the item 1583). Is it possible to customize this item to our needs? Our idea is to buy up to 50 wafers, depending on the price.
Reference #255029 for specs and pricing.
Actuators are devices that convert electrical, thermal, or other forms of energy into mechanical motion. The choice of substrate in actuator fabrication depends on the type of actuator (electrostatic, piezoelectric, thermal, etc.), performance requirements, and integration with other systems (e.g., MEMS, CMOS). Here are the most commonly used substrates for fabricating actuators:
Most common substrate for MEMS actuators.
Compatible with standard semiconductor processing.
Suitable for electrostatic, thermal, and piezoresistive actuators.
Can be processed to make flexures, cantilevers, and membranes.
Example: Microgrippers, microvalves, micromirrors (e.g., DMDs).
Ideal for high-precision MEMS actuators where electrical isolation or defined layer thickness is important.
Reduces parasitic capacitance, improves thermal isolation.
Useful in electrostatic comb-drive or piezoelectric layer-on-SOI actuators.
Used for actuators based on piezoelectric effects.
Common materials:
PZT (Lead Zirconate Titanate) – High actuation strain and force.
AlN (Aluminum Nitride) – CMOS-compatible, lower piezo response than PZT.
ZnO (Zinc Oxide) – Also used in thin-film applications.
Example: Micropumps, inkjet print heads, RF switches.
Often used when optical transparency or electrical insulation is needed.
Quartz is also piezoelectric, so it can serve dual functions.
Used for flexible or soft actuators.
Beneficial for biomedical applications (e.g., artificial muscles, microfluidics).
Can be combined with embedded electrodes or thermal expansion mechanisms.
Sometimes used for thermal bimorph actuators or shape memory alloy (SMA) actuators.
SMA materials (like NiTi) deform when heated.
| Actuator Type | Common Substrates | Notes |
|---|---|---|
| Electrostatic | Silicon, SOI | MEMS-compatible |
| Piezoelectric | PZT, AlN, ZnO, SOI | Thin films often deposited on Si |
| Thermal | Silicon, Polyimide | Thermal expansion or bimorphs |
| Shape Memory Alloy (SMA) | NiTi, Si with SMA layer | Deforms under heat |
| Soft/Bio Actuators | PDMS, SU-8, Hydrogels | Soft robotics, microfluidics |
If you’re targeting a specific application (e.g., biomedical, aerospace, RF MEMS), I can recommend the best substrate options based on constraints like temperature, flexibility, cost, and integration.