Silicon Wafers for Research and Production 

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Silicon Wafers

UniversityWafer supplies silicon (Si) wafers from 1″ to 12″ for R&D and pilot production. Order full cassettes or small lots—even a single wafer. Choose prime, test/monitor, or reclaimed, with options for oxide, nitride, or metal films.

Get ready-to-ship silicon wafers in your specs and orientation. Fast delivery, tight tolerances, proven quality.

Get Your Quote FAST! Or, Buy Online and Start Researching Today!





Why Buy from UniversityWafer?

  • Fast quotes & small MOQs: single pieces, partial cassettes, or full lots
  • Tight specs: low TTV/warp, cleanroom pack, documentation on request
  • Customization: dicing, thinning, flats/notch per SEMI, edge profile per spec

Popular Choices

  • 100 mm ⟨100⟩ p-type (B), 1–10 Ω·cm, SSP/DSP
  • 150 mm ⟨100⟩ n-type (P), 1–10 Ω·cm, DSP, low TTV
  • 200 mm & 300 mm silicon wafer test/monitor wafers for process development
  • High-resistivity (>10 kΩ·cm) for RF/detectors; low-ohmic for epi recipes
  • SOI (device layer & BOX per drawing; handle wafer per spec)

Coatings & Thin Films

  • Thermal SiO2: dry/wet growth at target thickness & uniformity
  • SiNx: LPCVD/PECVD for dielectric/passivation (specify stress)
  • Metals: Ti/Au, Cr/Au, Al, Pt, Ni and more; lift-off-friendly stacks available

Applications

  • Process development & monitoring (cost-effective test wafers)
  • Epitaxy & device R&D (orientation/resistivity to recipe)
  • Optics & photonics (polished carriers, thin-film substrates)
  • Solar/energy and packaging studies (thin wafers, coatings)
  • Chemistry & microfluidics (ultra-clean carriers)

Quote Checklist (speeds up turnaround)

  • Diameter + orientation (e.g., 100 mm, ⟨100⟩)
  • Type & resistivity (p-type B 1–10 Ω·cm, n-type P/Sb, or intrinsic)
  • Thickness + tolerances (TTV/bow/warp targets)
  • Surface (SSP/DSP) + roughness; edge profile & flats/notch to SEMI
  • Coatings (oxide/nitride) or metal stack
  • Quantity (single wafers / partial cassette / full)

Silicon Wafers — Sizes, Grades & Options

UniversityWafer supplies Si wafers from 1″ to 12″ with fast turnaround for R&D and pilot production. Order full cassettes or small lots (even a single wafer). We stock prime, test/monitor, and reclaimed wafers, and can build to print for custom specs.

What We Offer

  • Diameters: 1″, 2″, 3″, 4″, 6″, 8″, 12″ (others on request)
  • Orientations: ⟨100⟩, ⟨111⟩ (miscut options available, e.g., 2–4°)
  • Doping: Intrinsic/undoped, p-type (Boron), n-type (Phosphorus or Antimony)
  • Resistivity: From mΩ·cm (low-ohmic) to >10 kΩ·cm; narrow-bin sorting on request
  • Finishes: As-cut, lapped/etched, SSP, DSP; low TTV/warp options for lithography/epi
  • Coatings: Thermal oxide (dry/wet), LPCVD/PECVD silicon nitride, and sputtered/evaporated metals
  • Services: Dicing/scribing, edge-trim, deep thinning (spec-dependent), cleaning & packing

SOI & Specialty Silicon

  • SOI: Device layer thickness per spec (e.g., 20–5000 nm), BOX thickness control, handle wafer resistivity.
  • Low-particle wafers for front-end processing and optical applications.
  • High-resistivity (>10 kΩ·cm) for RF and detector work; low-ohmic for epi tool recipes.

Typical Metrology Targets

  • Thickness & TTV: Thickness per drawing; TTV options for stepper/aligner compatibility.
  • Bow/warp: Tight bow on larger diameters to aid clamping and CD control.
  • Roughness: SSP/DSP with low Ra for thin-film deposition and photolithography.
  • Particles/cleanliness: Cleanroom pack; optional pre-clean (RCA-style) on request.

Flats & SEMI Standards

  • Primary/secondary flats or notch to SEMI spec; orientation and type indicated by flat geometry.
  • Edge profile: Bevel/radius options per SEMI M1 for improved handling and reduced chipping.

Common Uses

  • Process development & monitoring: cost-effective test/monitor wafers
  • Epitaxy & device R&D: low-resistivity or specified orientation for reactors
  • Optics & photonics: polished carriers and thin-film substrates
  • Solar & energy: thin wafers for research cells, coatings, and packaging studies
  • Chemistry & microfluidics: ultra-clean carriers that minimize interaction with organics

Coatings & Thin Films

  • Thermal SiO2: Dry/wet growth, target thickness & uniformity; gate oxide or hard-mask use.
  • SiNx: LPCVD/PECVD for dielectric, barrier, or passivation layers (specify stress if needed).
  • Metals: Sputtered/evaporated Ti/Au, Cr/Au, Al, Pt, Ni, etc., with lift-off-friendly stacks.

Ordering & Quote Checklist

  • Diameter + orientation (e.g., 100 mm, ⟨100⟩)
  • Type & resistivity (e.g., p-type B, 1–10 Ω·cm)
  • Thickness + tolerances (TTV/bow/warp targets)
  • Surface (SSP/DSP, roughness target) & edge profile
  • Coatings (oxide/nitride) or metal stack, if any
  • Quantity (single wafers, partial cassette, or full)
  • Packing/cleanliness requirements (vac-pack, nitrogen, etc.)

Handling & Packaging

  • Vacuum-sealed, cleanroom-compatible packaging; cassettes or single-wafer ship kits.
  • Optional pre-clean prior to shipment; send your handling notes if you have a sensitive flow.

FAQ

Can I buy fewer than 25 wafers?
Yes—small quantities and single wafers are available.

Do you stock highly doped and intrinsic wafers?
Yes—undoped, low-doped, and heavily doped ranges are in stock.

Can you thin or dice to my drawing?
Yes—dicing and deep thinning are available; share target thickness and tolerances.

Do you supply SOI?
Yes—specify device layer, BOX thickness, handle wafer resistivity, and diameter.