| TS006 | P/B | [100] | 6" | 525 ±15 | P/E | MCZ 0.01--0.02 {0.015--0.017} |
| SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Non--standard Edge profile, Oxygen=(11--13)ppma, Carbon<1ppma, Empak cst |
| TS004 | P/B | [100] | 6" | 675 ±15 | P/E | MCZ 0.01--0.02 {0.013--0.017} |
| SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Oxygen=(3--9)ppma, Carbon<1ppma, Back--side: Acid etch, Empak cst |
| TS005 | P/B | [100] | 6" | 675 ±15 | P/E | MCZ 0.01--0.02 {0.013--0.016} |
| SEMI Prime, 1Flat 57.5mm @ <001>±0.5° {not @ <011>}, Oxygen=(3--9)ppma, Carbon<1ppma, Back--side: Acid etch, Empak cst |
| K667 | P/B | [100] | 6" | 900 | C/C | FZ >1,000 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 7038 | P/B | [111] ±0.5° | 6" | 875 | P/E | FZ >10,000 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 6898 | P/B | [111] ±0.5° | 6" | 1,000 | P/E | FZ >5,000 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 7208 | N/Ph | [100] ±1° | 6" | 1,000 ±50 | P/P | FZ >9,500 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, Lifetime>6,000μs |
| E239 | N/Ph | [100] | 6" | 825 | C/C | FZ 7,000--8,000 {7,025--7,856} |
| SEMI, 1Flat, Lifetime=7,562μs, in Open Empak cst |
| F907 | N/Ph | [100] | 6" | 3,000 | P/P | FZ >4,800 |
| SEMI Prime, 1Flat (57.5mm), Individual cst, Lifetime>7,000μs. |
| 7212 | N/Ph | [100] ±1° | 6" | 450 | P/P | FZ 4,300--8,300 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 7233 | N/Ph | [100] ±1° | 6" | 675 | P/P | FZ 4,300--8,300 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| L625 | N/Ph | [100--6° towards[111]] ±0.5° | 6" | 625 | P/E | FZ >3,500 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| E700 | N/Ph | [100--6° towards[111]] ±0.5° | 6" | 675 | P/P | FZ >3,500 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| F700 | N/Ph | [100--6° towards[111]] ±0.5° | 6" | 790 ±10 | C/C | FZ >3,500 |
| SEMI, 1Flat, Empak cst |
| 4982 | N/Ph | [100--6° towards[111]] ±0.5° | 6" | 675 | P/P | FZ >1,000 |
| SEMI Prime, Notch on <010> {not on <011>}, Laser Mark, Empak cst |
| D982 | N/Ph | [100--6° towards[111]] ±0.5° | 6" | 675 | BROKEN | FZ >1,000 |
| SEMI notch Broken -- one piece ~50% of wafers other pieces ~20% of wafer, Empak cst |
| 7122 | N/Ph | [100] | 6" | 500 ±10 | P/P | FZ 50--70 |
| SEMI Prime, 1Flat, Empak cst |
| G122 | N/Ph | [100] | 6" | 500 ±10 | P/P | FZ 50--70 |
| SEMI Prime, 1Flat, Empak cst |
| 5325 | N/Ph | [100] | 6" | 725 | P/P | FZ 50--70 {57--62} |
| SEMI Prime, 1Flat (57.5mm), Lifetime=15,700μs, Empak cst |
| 7053 | N/Ph | [100] | 6" | 2,000 | P/P | FZ 50--70 |
| SEMI Prime, 1Flat (57.5mm), Cassettes of 10 + 6 wafers |
| 6883 | N/Ph | [100] | 6" | 625 ±5 | P/P | FZ 40--90 |
| SEMI Prime, 1Flat (57.5mm), Total Thickness Variation TTV <3μm,, Empak cst |
| G883 | N/Ph | [100] | 6" | 650 ±5 | P/P | FZ 40--90 |
| SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst |
| F883 | N/Ph | [100] | 6" | 675 ±5 | P/P | FZ 40--90 |
| SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst |
| S5622 | N/Ph | [100] | 6" | 1,300 ±10 | E/E | FZ 0.01--0.05 |
| SEMI notch, Empak cst |
| G228 | N/Ph | [111] ±0.5° | 6" | 300 ±15 | BROKEN | FZ >6,000 |
| Test, Broken into a dozen large pieces ranging from 65% of wafer to 5% and small pieces as well |
| N445 | N/Ph | [112--5.0° towards[11--1]] ±0.5° | 6" | 875 ±10 | E/E | FZ >3,000 |
| SEMI, 1Flat (47.5mm), TTV<4μm, Surface Chips |
| G343 | N/Ph | [112--5° towards[11--1]] ±0.5° | 6" | 1,000 ±10 | C/C | FZ >3,000 |
| SEMI, 1 JEIDA Flat (47.5mm), Empak cst, TTV<4μm, Lifetime>1,000μs |
| 7116 | Intrinsic Si:- | [100] | 6" | 675 | P/P | FZ >65,000 |
| SEMI notch Prime, Empak cst |
| M526 | Intrinsic Si:- | [100] ±0.1° | 6" | 720 ±10 | P/P | FZ >10,000 |
| SEMI Prime, 1Flat (57.5mm), TTV<3μm, Empak cst |
| 7117 | Intrinsic Si:- | [111] ±0.5° | 6" | 875 | P/P | FZ >10,000 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| F613 | P/B | [110] ±0.5° | 6" | 300 | P/P | 20--25 |
| SEMI TEST -- scratched, can be repolished & thinned for extra fee, 2Flats, in unsealed Empak cst |
| G458 | P/B | [110] ±0.5° | 6" | 390 ±10 | C/C | >10 |
| 2Flats, Empak cst |
| TS002 | P/B | [110] ±0.25° | 6" | 625 ±15 | P/E | 10--20 {11--15} |
| SEMI Prime, 1 JEIDA Flat (47.5mm) @ <111>, TTV<3μm, Bow<5μm, Warp<10μm, hard cst |
| TS007 | P/B | [110] ±0.25° | 6" | 625 ±15 | P/E | 10--20 {13.6--13.9} |
| SEMI Prime, 1 JEIDA Flat 47.5mm @ <111>±0.5°, LaserMark, TTV<2μm, Warp<10μm, Empak cst |
| TS072 | P/B | [110] ±0.25° | 6" | 625 ±15 | P/E | 10--20 |
| SEMI Prime, 1 JEIDA Flat (47.5mm) @ <111>±0.5°, Laser Mark, TTV<3μm, Bow<5μm, Warp<10μm, Empak cst |
| 6427 | P/B | [110] ±0.5° | 6" | 675 | P/E | 0.01--0.02 |
| Prime, PFlat @ [111]±0.25°, SF @ [111]±5° 109.5° CW from PF, Empak cst |
| TS054 | P/B | [100] | 6" | 675 | P/E | 15--25 {16.1--21.7} |
| SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
| 4980 | P/B | [100] | 6" | 220 | P/P | 10--30 |
| SEMI 1Flat (57.5mm), TEST grade (surface scratches & digs), TTV<4μm, Unsealed in Empak cst |
| L405 | P/B | [100] | 6" | 1,000 | P/P | 10--15 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, 4 Prime wafers plus 2 scratched wafers at no cost |
| 7066 | P/B | [100] | 6" | 675 | P/P | 5--10 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 6287 | P/B | [100] | 6" | 675 | P/E | 5--10 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 6751 | P/B | [100] | 6" | 1,000 | P/E | 5--10 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 7030 | P/B | [100] | 6" | 1,000 | P/E | 5--10 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| E964 | P/B | [100] | 6" | 475 | P/P | 1--30 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 5964 | P/B | [100] | 6" | 500 | P/P | 1--30 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
| D964 | P/B | [100] | 6" | 500 | P/P | 1--30 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
| 5354 | P/B | [100--9.7° towards[001]] ±0.1° | 6" | 525 | P/P | 1--100 |
| SEMI Prime, 1Flat (57.5mm) at <110>±0.1°, Empak cst |
| B420 | P/B | [100] | 6" | 675 | P/P | 1--5 |
| SEMI Prime, 1Flat, Soft cst |
| 6358 | P/B | [100--6° towards[111]] ±0.5° | 6" | 675 | P/E | 1--30 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| N698 | P/B | [100] | 6" | 675 | P/E | 1--100 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 6404 | P/B | [100] | 6" | 800 | E/E | 1--50 |
| SEMI, 1Flat (57.5mm), Empak cst, TTV<5μm |
| F162 | P/B | [100] | 6" | 2,000 ±50 | P/P | 1--35 |
| SEMI Prime, 1Flat (57.5mm), Individual cst, Group of 6 wafers |
| E162 | P/B | [100] | 6" | 2,000 ±50 | P/E | 1--35 |
| SEMI Prime, 1Flat (57.5mm), Group of 2 wafers, Back--Side polished with small scratches |
| 7047 | P/B | [100] | 6" | 400 | P/P | 0.5--1.0 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| S5821 | P/B | [100] | 6" | 275 | P/P | 0.01--0.05 |
| SEMI Prime, 1Flat (57.5mm), TTV<2μm, Empak cst |
| TS104 | P/B | [100] | 6" | 625 ±15 | P/EOx | 0.01--0.02 {0.0139--0.0144} |
| SEMI Prime, JEIDA Flat 47.5mm, Back--side LTO (0.3--0.4)μm, TTV<6μm, Empak cst |
| TS055 | P/B | [100] | 6" | 675 ±15 | P/E | 0.01--0.02 {0.0102--0.0133} |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| TS103 | P/B | [100] | 6" | 525 ±15 | P/E | 0.007--0.015 {0.0126--0.0134} |
| SEMI Prime, 1Flat (57.5mm), TTV<5μm, Empak cst |
| 6005 | P/B | [100] | 6" | 320 | P/E | 0.001--0.030 |
| JEIDA Prime, Empak cst |
| 6484 | P/B | [100] | 6" | 675 | P/E | 0.001--0.005 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| TS108 | P/B | [111--3°] ±0.5° | 6" | 625 ±15 | P/E | 0.01--0.02 |
| SEMI Prime, 1Flat (57.5mm), TTV<8μm, Empak cst |
| J668 | P/B | [111] ±0.5° | 6" | 675 | E/E | 0.010--0.025 |
| SEMI, 1Flat (57.5mm), Empak cst, TTV<5μm |
| TS105 | N/As | [111--1.5°] ±0.35° | 6" | 675 | P/EOx | 0.001--0.002 {0.0017--0.0018} |
| SEMI Prime, 1Flat (57.5mm), Back--side LTO 400±40nm, TTV<6μm, Empak cst |
| 5814 | N/Ph | [100] | 6" | 925 ±15 | E/E | 5--35 {12.5--29.7} |
| JEIDA Prime, Empak cst, TTV<5μm |
| B728 | N/Ph | [100] | 6" | 675 | P/E | 2.7--4.0 |
| SEMI Prime, Empak cst |
| TS063 | N/Ph | [100] | 6" | 525 | P/E | 1--3 {1.1--1.5} |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| TS075 | N/Ph | [100] | 6" | 525 | P/E | 1--3 {1.5--2.0} |
| SEMI Prime, Flat: JEIDA 47.5mm, Oxygen=(10--14)ppma, Carbon<1ppma, Empak cst (14 + 12 wafers) |
| TS076 | N/Ph | [100] | 6" | 525 | P/E | 1--3 {1.1--2.3} |
| SEMI Prime, Flat: JEIDA 47.5mm, Oxygen=(10--14)ppma, Carbon<1ppma, Empak cst (8+24+25 wafers) |
| 6971 | N/Ph | [100--25° towards[110]] ±1° | 6" | 675 | P/P | 1--100 |
| SEMI notch Prime, Empak cst, TTV<1μm |
| 6965 | N/Ph | [100] | 6" | 675 ±10 | P/E | 1--10 {4.34--5.36} |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 7170 | N/Ph | [100] ±1° | 6" | 675 | P/E | 1--20 {1.8--12.0} |
| Prime, 2 SEMI Flats, Back--side Acid etched, Empak cst |
| C716 | N/Ph | [100--28° towards[110]] ±1° | 6" | 700 | P/P | 1--100 |
| SEMI Notch Prime, TTV<2μm, Empak cst |
| S5913 | N/Ph | [100] ±1° | 6" | 800 | P/E | 1--10 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| F859 | N/Ph | [100--25° towards[110]] ±1° | 6" | 800 | C/C | 1--100 |
| SEMI notch Prime, Empak cst |
| E089 | N/Ph | [100] | 6" | 1,910 ±10 | P/P | 1--100 |
| SEMI Prime, 1Flat (57.5mm), TTV<2μm, in stacked trays of 2 wafers |
| F089 | N/Ph | [100] | 6" | 1,910 ±10 | P/P | 1--100 |
| SEMI Prime, 1Flat (57.5mm), TTV<5μm, sealed in stacked trays of 1 + 3 wafer |
| G844 | N/Ph | [100] | 6" | 5,000 | P/P | 1--35 |
| SEMI Prime, 1Flat (57.5mm), Individual cst |
| L066 | N/Sb | [100] | 6" | 675 | P/E | 0.01--0.02 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| C673 | N/Sb | [100] | 6" | 675 | P/E | 0.008--0.020 |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 2533 | N/As | [100] | 6" | 1,000 | L/L | 0.0033--0.0037 |
| SEMI, 1Flat(57.5mm), in individual wafer cassettes |
| E533 | N/As | [100] | 6" | 1,000 | L/L | 0.0033--0.0037 |
| SEMI, 1Flat(57.5mm), in individual wafer cassettes |
| TS018 | N/As | [100] | 6" | 575 ±15 | P/P | 0.001--0.005 {0.0040--0.0041} |
| SEMI Prime, 2Flats (PF @ <110>±1°, SF 135° from PF}, Laser Mark, Empak cst |
| 4204 | N/As | [100] | 6" | 675 | P/EOx | 0.001--0.005 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, Back--side LTO (0.64--0.666)um, TTV<4μm, Bow/Warp<20μm |
| 5541 | N/Ph | [100] | 6" | 675 | P/EOx | 0.001--0.002 |
| SEMI Prime, 1Flat (57.5mm), with strippable Epi layer Si:P (0.32--0.46)Ohmcm, 3.20±0.16μm thick, Empak cst |
| TS101 | N/As | [100] | 6" | 675 ±15 | P/EOx | 0.001--0.005 {0.0036--0.0041} |
| SEMI Prime, 1Flat (57.5mm), TTV<5μm, LTO (0.3--0.6)μm, Empak cst |
| TS037 | N/Ph | [111--1.5°] ±0.5° | 6" | 675 | P/E | 3--12 {5.0--8.8} |
| SEMI Prime, 1Flat (57.5mm), Empak cst |
| 6559 | N/Ph | [111] ±0.5° | 6" | 675 | P/E | 1--100 |
| Prime, NO Flats, Empak cst |
| TS112 | N/As | [111--4°] ±0.5° | 6" | 508 | P/E | 0.0038--0.0042 |
| SEMI Prime, 1Flat (57.5mm), Back--side: LTO 600nm thick, Empak cst |
| TS034 | N/As | [111--4°] ±0.25° | 6" | 625 ±15 | P/EOx | 0.0024--0.0035 {0.0029--0.0030} |
| SEMI Prime, 1Flat (57.5mm), Back--side: LTO 600nm thick, Empak cst |
| TS109 | N/As | [111--4°] ±0.5° | 6" | 508 ±15 | P/E | 0.0023--0.0026 |
| SEMI Prime, 1Flat (57.5mm), TTV<8μm, Empak cst |
| TS102 | N/As | [111--4°] ±0.5° | 6" | 675 | P/E | 0.001--0.005 |
| SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<4μm, Bow<10μm, Warp<20μm |
| TS107 | N/As | [111--2.5°] ±0.5° | 6" | 625 ±15 | P/EOx | 0.001--0.004 {0.0021--0.0036} |
| SEMI Prime, JEIDA Flat (47.5mm), Back--side LTO (0.45--0.55)μm, TTV<6μm, Empak cst |