Silicon Wafers for Semiconductor Manufacturing, MEMS, Photonics & Research

UniversityWafer supplies silicon wafers and silicon substrates for semiconductor fabrication, MEMS, silicon photonics, sensors, power electronics, thin-film research, and university laboratories. Choose from prime grade, test grade, mechanical, reclaimed, Float Zone (FZ), and Czochralski (CZ) wafers. Standard and custom Si wafers are available from 1 inch through 300 mm, with options for crystal orientation, dopant type, resistivity, thickness, SSP/DSP polishing, thermal oxide, nitride, and specialty coatings.

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Find the Right Silicon Wafer for Your Project

Whether you are developing an integrated circuit, fabricating MEMS devices, depositing thin films, building photonic components, or conducting university research, UniversityWafer supplies silicon wafers matched to your process requirements. Choose standard or custom silicon substrates by diameter, orientation, conductivity type, resistivity, thickness, surface finish, and coating. Small quantities are available for prototyping, with larger quantities for production.

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Recent Research Inquiry

"We are fabricating MEMS pressure sensors and require 100 mm, <100> orientation, double-side polished silicon wafers with a thickness of 525 ± 25 µm. Could you also provide thermal oxide-coated wafers for comparison testing?"

UniversityWafer Response: We can supply prime-grade silicon wafers with custom orientations, polishing, oxide thicknesses, and electrical properties for MEMS, semiconductor, photonics, and advanced research applications.

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What Are Silicon Wafers?

Silicon wafers are ultra-flat, thin slices of single-crystal silicon that serve as the foundation for nearly every modern electronic device. They are used to fabricate integrated circuits (ICs), MEMS, sensors, photonic devices, power electronics, and solar cells. Through processes such as oxidation, photolithography, ion implantation, etching, and thin-film deposition, silicon wafers are transformed into the semiconductor devices found in computers, smartphones, automobiles, medical equipment, and communication systems.

UniversityWafer supplies prime, test, monitor, mechanical, reclaimed, Czochralski (CZ), and Float Zone (FZ) silicon wafers with custom diameters, crystal orientations, resistivities, thicknesses, polishing options, and deposited films for research, prototyping, and production.

Silicon wafer applications including semiconductors, MEMS, photonics, power devices, research, and thin-film deposition

Common Applications

Silicon Wafer Types

Wafer Type Typical Use
Prime Grade Semiconductor manufacturing and high-performance devices
Test Grade Process development, equipment qualification and R&D
Mechanical Grade Training, wafer handling and equipment setup
Float Zone (FZ) High-resistivity power electronics and detector research
Czochralski (CZ) General semiconductor manufacturing and MEMS fabrication
Reclaimed Wafers Cost-effective process evaluation and equipment testing

Available Specifications

Our silicon wafers are available in numerous research and production configurations, including:

  • Diameters from 1 inch (25.4 mm) to 12 inches (300 mm)
  • <100>, <110>, <111>, and custom crystal orientations
  • P-type, N-type, intrinsic, and undoped silicon
  • Boron, phosphorus, arsenic, and antimony dopants
  • Single-side polished (SSP) and double-side polished (DSP)
  • Thermal oxide, silicon nitride, metal coatings, and custom thin films
  • Custom thicknesses, resistivities, and edge profiles

Custom Silicon Wafer Solutions

UniversityWafer supplies both standard inventory and custom silicon wafers for semiconductor manufacturers, research laboratories, startups, and universities. Custom specifications can include wafer diameter, thickness, crystal orientation, resistivity, p-type or n-type doping, SSP or DSP polishing, thermal oxide, silicon nitride, metal films, and other deposited coatings for MEMS, photonics, sensors, power devices, and process development.

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