Silicon Wafer Orientation (111) for Research & Production

university wafer substrates

(111) Oriented Silicon Wafers Used to Demonstrate Cleavage Planes

An assistant professor requested a quote for the following:

Can you please send a quote for 100 wafers? 50 each of 100mm
(111) and 100mm (100). Other technical specifications don't matter, these are just for demonstrating cleavage planes in an introductory materials course.

Reference #213245 for specs and pricing.

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What are Cleavage Planes?

In crystallography and materials science, cleavage planes refer to the specific directions or surfaces along which a crystal can be more easily split or cleaved. Grasping these cleavage planes matters, you know. Why? Because they spill the beans on what's going inside that crystal - its inner structure and how it bonds. Cool, right? Here's a more detailed explanation:

Definition of Cleavage Planes: A cleavage plane is a flat surface along which a crystal can be easily split. These planes are determined by the arrangement of atoms or molecules in the crystal lattice, the internal repeating pattern that makes up the crystal.

Bond Strength and Cleavage: Cleavage occurs along planes where the bonds holding the atoms or molecules together are weakest. For instance, in some minerals, atoms are tightly bonded in one direction but less so in another, creating potential cleavage planes in the less tightly bonded direction.

Cleavage Quality: The quality of cleavage can vary. Some materials, like mica, have perfect cleavage, meaning they can be split into very thin sheets along their cleavage planes. Others may have good, poor, or no cleavage, depending on how uniformly the atomic planes are arranged and bonded.

Importance in Various Fields: Understanding cleavage planes is crucial in various fields. Within the realm of geology, discerning how minerals fracture is instrumental—it not only aids in identifying their nature but also unravels the mystery of their genesis. In the realm of materials science and engineering, getting a handle on cleavage planes is key. Why? Well, they clue us in on crucial mechanical traits like strength and how long stuff lasts.

Applications: In gem cutting, the cleavage planes of a crystal are considered to achieve the desired shape and size with minimal waste. Just like how we shape gems, understanding the ins and outs of cleavage planes can really change the game when it comes to creating materials for tech stuff. For example, with semiconductors, knowing these details can help us figure out how to process them and put them into action effectively.

So, let's break it down. Cleavage planes are like the built-in lines in crystals that dictate how they split up - a bit like scoring paper before you tear it. This is all tied to their atomic makeup and stuff. But here's where it gets interesting; these cleavage planes aren't just for show, they've got some serious implications in different fields - think science labs and industry applications!

 

Inventory of (111) Silicon Wafer

Below are just some of the (111) oriented Silicon Substrates that we have in stock. Please let us know what specs and quantity you would like us to quote?

Item Material
Dopant		 Orient. Diam
(mm)		 Thck
(μm)		 Surf. Resistivity
Ωcm		 Comment
3228 n-type Si:P [111] ±0.5° 6" 300 ±15 P/P FZ >6,000 SEMI Prime, 1Flat (57.5mm), Lifetime>1,000μs, Empak cst
3779 n-type Si:P [111] ±0.5° 6" 300 ±15 P/P FZ >6,000 SEMI Prime, 1Flat (57.5mm), Lifetime>1,000μs, Empak cst
E179 Intrinsic Si:- [111] ±0.5° 6" 750 E/E FZ >10,000 SEMI notch, TEST (defects, cannot be polished out), Empak cst
9023 P/B [111-4.0°] ±0.5° 6" 625 P/E 4--15 {7.1-8.8} SEMI Prime, 1 JEIDA Flat(47.5mm), Empak cst
D339 n-type Si:P [111] ±0.5° 6" 675 P/E 1--100 SEMI Prime, NO Flats, Empak cst
4142 Intrinsic Si:- [111] ±0.5° 6" 675 C/C FZ >10,000 SEMI notch, Empak cst
F083 n-type Si:P [111] ±0.1° 5" 200 ±15 BROKEN FZ >3,000 Broken L/L wafers, in 2 pieces
E962 n-type Si:P [111] 5" 300 ±15 P/E FZ 1,000-3,000 SEMI Prime, in hard cassettes of 8 wafers
B862 n-type Si:Sb [111-3.0°] ±0.5° 5" 625 P/E 0.015-0.020 {0.0152-0.0185} SEMI Prime, 2Flats, Empak cst
4219 P/B [111] ±0.5° 4" 400 ±15 P/E FZ >20,000 SEMI Prime, 1Flat, Empak cst, TTV<5μm, Lifetime>1,000μs
L173 P/B [111] ±0.5° 4" 397 P/E FZ 10,000-15,000 SEMI Prime, Backside ACID Etched, Empak cst
K845 n-type Si:P [111] ±0.25° 4" 675 P/E FZ 10,000-20,000 SEMI TEST (Light scratches), 1Flat, Lifetime>1,000μs, Empak cst,
C170 n-type Si:P [111] ±0.5° 4" 500 P/E FZ 10,000-15,000 SEMI Prime, 1Flat, Empak cst, TTV<5μm
D465 n-type Si:P [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI, 1Flat, in Empak, Lifetime>1,600μs
E465 n-type Si:P [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI TEST (Scratches, in Unsealed Empak cassette), 1Flat, Lifetime>1,600μs
B465 n-type Si:P [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI, 1Flat, Lifetime>1,600μs, in Empak cassettes of 6 and 8 wafers
1679 n-type Si:P [111] ±0.5° 4" 630 P/G FZ >7,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs, Back-side Fine Ground
G845 n-type Si:P [111] ±0.25° 4" 675 P/E FZ 7,000-10,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs, Light scratches
Q212 n-type Si:P [111] ±0.5° 4" 150 ±10 BROKEN FZ 5,000-10,000 Broken P/E wafers, in Empak
D850 n-type Si:P [111] ±0.25° 4" 675 P/E FZ 5,000-7,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs
F845 n-type Si:P [111] ±0.25° 4" 675 P/E FZ 5,000-7,000 SEMI TEST (light scratches), 1Flat, Lifetime>1,000μs, in Empak
B852 n-type Si:P [111] ±0.5° 4" 525 P/E FZ >5,000 SEMI Prime, 1Flat, Lifetime>1,000μs, Empak cst
D852 n-type Si:P [111-1° towards[110]] ±0.5° 4" 525 P/E FZ >5,000 SEMI TEST (scratches on back-side), 1Flat, Empak cst
M845 n-type Si:P [111] ±0.25° 4" 525 P/E FZ 3,000-5,000 SEMI TEST (light scratches), 1Flat, Empak cst
L845 n-type Si:P [111] ±0.25° 4" 525 P/E FZ 3,000-5,000 SEMI Prime, 1Flat, in Empak cassettes of 3, 3 & 4 wafers