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We offer freestanding super thin silicon wafers with thicknesses ranging from 5µm to 100µm and with diameters from 5mm to 150mm. The thin Silicon wafers are true mirror finish DSP, good surface flatness, haze-free, void-free, and have low surface RMS (typical 1-2nm) and an ultralow TTV typically less than +/-1µm.
Below are just some of out wafers uses.
Based on a proprietary combination of temporary wafer bonding, lapping, polishing, and debonding process,
Microscale offers super thin silicon wafers with thicknesses ranging from 5µm to 100µm and with diameters from 1” to 6”.
Departing from the conventional wafer attachment using tapes, the technology utilize a specialty polymer for temporary wafer bonding
in order to reduce Silicon thickness to super thin. The thin Silicon wafers are haze-free, void-free, and have low surface roughness (RMS) typically 1-2nm and an ultra-low Total Thickness Variation (TTV) typically less than +/-1µm. Microscale further offers customized thin Silicon manufacturing.
Super thin wafer dicing service is available upon request.
Thin Silicon Wafers with Stiffner:
Thin silicon wafers are also offered in attachment with a rigid wafer ring. The wafer-ring setup facilitates handling of the super thin silicon and easily mountable to custom lab fixtures.
Below is a human hair. Hair is abour 100µm thick. Out thin Si wafers are 2µm thin. Think of the possibilities!