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Airco Temescal HRS 2550

Airco Temescal HRS 2550 Sputtering System

Overview

The Airco Temescal HRS 2550 is a floor-standing batch sputtering system (shown with its bell-jar chamber lid closed). It was designed for high-rate physical vapor deposition of thin films in semiconductor manufacturing. The HRS 2550 (often expanded as “High-Rate Sputtering 2550”) is a multi-target vacuum sputtering tool introduced by Airco Temescal, a division of Airco that specialized in thin-film deposition equipment. It is a batch sputter deposition system accommodating multiple wafers at once, used to deposit metal and other thin-film materials onto semiconductor substrates under high vacuum. The tool features a cylindrical vacuum chamber (bell jar style) and an integrated pumping station and control electronics cabinet as part of its chassis​wotol.com​wotol.com. Originally developed in the 1980s–1990s era, the HRS 2550 was employed in fabrication processes for microelectronics and optoelectronics – for example, depositing metal interconnects, contact layers, or seed layers in integrated circuits and compound semiconductor devices. It was known for its high deposition rates and ability to handle relatively large batch loads, making it suitable for both production and R&D environments of its time​wotol.com.

Key Specifications

Below is a summary of key technical specifications of the Airco Temescal HRS 2550 sputtering system, gathered from available datasheets and documentation​wotol.com​wotol.com:

Sources: The above specifications are summarized from an Airco Temescal HRS 2550 technical data sheet​wotol.com​jmind.com. They highlight the tool’s capacity for high-throughput, high-rate sputtering.

Features and Design

Triple-Target Sputtering: One of the main features of the HRS 2550 is its three cathode (tri-target) configuration​jmind.com. This means the system can accommodate three distinct sputtering targets (materials) mounted in the chamber simultaneously. Typically, these would be planar magnetron cathodes arrayed at the chamber’s base or periphery. The triple-target design allows sequential deposition of multiple layers (or different materials) in one pump-down cycle – for example, depositing a metal stack without breaking vacuum between layers. In some configurations it may also permit co-sputtering (simultaneous sputtering from multiple targets) for alloy or composite film deposition, though usually the system would sputter one target at a time while a rotating substrate carousel ensures uniform coverage​wotol.com. Each cathode can be driven by the main 5 kW DC power supply (for conductive targets), and an RF power supply is available to sputter non-conductive targets (RF sputtering mode)​jmind.com. The target size (~8.25″ × 3.56″) suggests rectangular magnetron cathodes, a common design for uniform large-area deposition​wotol.com. The magnetrons likely use strong magnets to confine the plasma and achieve the high deposition rates (15–20 kÅ/min) that give the HRS its “High Rate” name.

Vacuum Chamber and Substrate Handling: The HRS 2550 uses a stainless steel vacuum chamber in a bell-jar configuration (cylindrical chamber with a lifting lid). The lid is water-cooled and may be counter-balanced or spring-assisted for easy opening​sctec.com. Inside, substrates are loaded onto a vertical carousel fixture​wotol.com. In the standard configuration, this carousel holds up to 64 small wafers (2-inch diameter) arranged in tiers, which was ideal for compound semiconductor or research labs processing many small substrates in one run. The carousel rotates during deposition to improve film uniformity. An optional “flip-flop” mechanism could be installed – this likely refers to a substrate flipping or planetary motion to coat both sides of substrates or to further improve uniformity by changing orientation mid-process​wotol.com. For larger wafers, an alternative rotating fixture can be used; as noted, the system could be outfitted to handle up to four 8-inch wafers in one batch by using a larger rotating platen​wotol.com. This flexibility in fixturing made the HRS 2550 adaptable to different wafer sizes and throughputs.

High Vacuum Pumping and Automation: To achieve a clean vacuum environment (necessary for high-quality films), the HRS 2550 includes a two-stage vacuum system. First, a roughing pump (mechanical rotary vane pump) evacuates the chamber down to the low milliTorr range. Then a large diffusion pump takes over to reach high vacuum (~10^–7 to 10^–8 Torr)​jmind.com. The diffusion pump in this system is quite massive (10″ inlet, ~5300 L/s pumping speed)​jmind.com, enabling fast pump-down and the ability to handle outgassing from many substrates. A water-cooled cold trap and baffle assembly is placed above the diffusion pump to condense backstreaming oil vapors, protecting the chamber and substrates from contamination​jmind.com. All the high-vacuum valves (main chamber isolation valve, roughing valve, high-vacuum bypass throttle) are electropneumatically actuated, and an automatic sequencing controller manages the pumpdown process​jmind.com​sctec.com. The system can be run in automatic mode, where a single button push drives the chamber from atmosphere to high vacuum with the proper valve timing, or in manual mode for maintenance or process tuning​sctec.com. This level of automation was advanced for its time, simplifying operation for production use.

Power Supply and Controls: The HRS 2550’s control console houses the power supplies for sputtering and the control electronics. The main sputter power supply provides up to 5 kW DC at adjustable voltage (50–800 V) and current (0.2–7 A)​wotol.com, with meters to monitor voltage and current (including fine measurement scales for low current)​wotol.com. Safety interlocks ensure high voltage is only applied when the vacuum is sufficient, cooling water is flowing, and the chamber lid is closed and latched​jmind.com​jmind.com. There is also an RF generator unit (likely matching network and RF power supply) to drive one of the cathodes for RF sputtering tasks​jmind.com. The front panel (as seen in a refurbished unit’s photo) is populated with analog gauges, switches, and indicator lights, reflecting the era of design where most controls were hard-wired and manually operated, with a rudimentary logic for automatic sequences. Modern upgrades (offered by some retrofit companies) can replace or supplement these controls with PLC-based or PC-based controllers for improved reliability and recipe automation​sctec.com.

Throughput and Performance: As a high-rate sputter tool, the HRS 2550 excels at depositing films rapidly. For instance, depositing a 1 µm thick aluminum film could theoretically be done in under a minute at 15,000 Å/min rate. In practice, the throughput for a given film and thickness depends on the target material, power settings, and how many wafers are being coated. The system’s batch nature (dozens of wafers at once) made it efficient for volume production of, say, discrete devices or III-V semiconductor wafers in the 1980s-90s. With uniformity specified around ±5% across the load​wotol.com, it met the needs for many applications like metallization of device wafers. The large pumping capacity and water-cooled shields enabled the system to handle consecutive runs with minimal downtime for pumpdown. However, deposition processes that required ultra-high purity or extremely low base pressures might opt for a cryopump upgrade – the available CTI-10 cryopump option would eliminate diffusion pump oil and could improve base vacuum and reduce contamination​jmind.com. This was particularly useful for sensitive films or when depositing materials that react with hydrocarbons. In summary, the HRS 2550’s features – multi-target flexibility, high power sputter sources, substrate heating, and robust vacuum system – provided a versatile platform for thin-film deposition in its era.

Applications in Semiconductor Manufacturing

The Airco Temescal HRS 2550 was used in a variety of semiconductor manufacturing contexts, thanks to its flexibility and batch processing capability. Some typical applications and use cases include:

• Metallization of Integrated Circuits: In earlier-generation IC fabrication (for example, during the 1980s), batch sputtering systems like the HRS 2550 could be used to deposit metal interconnect layers or electrode structures. Aluminum metallization was very common for IC interconnects; the HRS 2550’s ~15 kÅ/min aluminum rate​wotol.com made it feasible to deposit required thicknesses quickly. Similarly, it could sputter refractory metals or barrier layers (tungsten, titanium, TiN, etc.) needed in certain processes. However, as silicon wafer sizes grew and cluster tools became standard, single-wafer sputter tools from companies like Applied Materials became more dominant in mainstream IC fabs. The HRS 2550, being a standalone batch tool, found more use either in smaller-scale production or in supporting roles (e.g. sputtering contacts on wafers for wafer probe, depositing backside metallization, etc.).

• Compound Semiconductor Device Fabrication: Airco Temescal equipment had a strong presence in the compound semiconductor industry (GaAs, InP, etc.), and the HRS 2550 was well-suited for this sector. Compound semiconductor wafers (e.g. GaAs) were smaller (2″–4″ diameters were common in the past), and manufacturers often processed many in parallel. The HRS 2550’s 64×2″ capacity​wotol.com was advantageous for depositing ohmic contact metals, gate metals, or dielectric layers on III-V device wafers (for MMICs, laser diodes, LED chips, etc.). Its high deposition rate for gold or other metals would be useful for thick metallization on power devices or microwave devices. Temescal’s own marketing noted that they addressed “a broad range of materials used in the compound semiconductor industry”​ferrotec.com. In fact, Temescal’s evaporators became especially popular for III-V metallization, but the HRS sputtering system provided an alternative for films where sputtering was preferred (e.g. when depositing certain alloys or when needing better step coverage than evaporation can provide).

• Thin-Film Resistors, Capacitors, and MEMS: The HRS 2550 could also deposit materials for thin-film passive components (like nichrome or tantalum for resistors, various dielectrics for capacitors) in hybrid circuits or on ceramic substrates. Its RF sputtering capability meant it could sputter insulating films (e.g. SiO₂ or Si₃N₄) by RF magnetron sputtering if targets of those materials were used. In MEMS fabrication, sputtering tools like this are used to deposit metal layers (for electrodes, interconnects) and sometimes insulating layers. Given the HRS 2550’s batch processing, a university or R&D lab might have used it to coat many small samples or wafers simultaneously for research projects in MEMS or sensors.

• General Thin-Film Coating: Beyond microelectronics, any application requiring deposition of metal or dielectric thin films on substrates could use the HRS 2550. For example, it could be employed in coating optical components with thin metallic films, or in depositing films on glass, ceramics, or polymers for various device fabrication. Its relatively large chamber (25″ diameter) could even accommodate odd-shaped parts or multiple fixtures, making it useful for coating batches of small components (like optical filters, mirrors, or even tool bits with thin films, though dedicated coaters are usually used for tools). The versatility of sputtering (ability to deposit metals, alloys, some insulators, etc.) meant the HRS 2550 might be found in diverse industries including research institutions and small-scale production facilities.

It’s worth noting that while the HRS 2550 was capable, in high-volume silicon wafer production it eventually gave way to newer systems. By the late 1990s and 2000s, cluster tools (with single-wafer load-locks and multi-chamber modules) became the standard for semiconductor sputtering due to better process control, throughput, and integration. Thus, the HRS 2550 and similar batch tools found longer life in niche applications, legacy production lines, or R&D labs. Even so, the HRS 2550’s design, which was “engineered for precise thin-film deposition”, remained relevant for many thin-film deposition needs​caeonline.com. Some users also repurposed such systems for sputter etching or pre-clean: by introducing a RF bias on the substrate and argon plasma, the system could etch or descum surfaces before deposition. The inclusion of an RF power supply suggests the HRS 2550 could support an etch mode (common in sputter tools to clean the substrate in-situ prior to coating). This dual capability (etch + deposit) in one chamber can be efficient for certain process flows, though it’s generally limited to simpler etch tasks.

Historical and Corporate Context

Airco Temescal Background: Temescal is a name with a long history in the thin-film equipment field. The Temescal company was originally founded in 1952 in California​ferrotec.com​eetimes.com. It became renowned as a pioneer in electron-beam evaporation systems, having developed key e-beam source technology (such as the 270° deflection electron beam gun in the early 1970s)​compoundsemiconductor.net. The company’s expertise in evaporation made their tools ubiquitous in metallization for compound semiconductors and other applications. At some point, Temescal was acquired by Airco (The Air Reduction Company) and operated as Airco Temescal, a division focusing on vacuum coating equipment. Under Airco’s umbrella, Temescal expanded into magnetron sputtering systems as well – an article by Temescal notes, “through Airco-Temescal we patented and developed apparatus using magnetron sputtering” in response to industry trends​compoundsemiconductor.net. The HRS series sputtering systems (including the HRS 2550) were products of that era, leveraging Temescal’s vacuum technology know-how to implement high-rate sputtering for production use.

Corporate Changes: In 1978, Airco (including the Temescal division) was acquired by the British Oxygen Company (BOC). Temescal then became part of BOC Coating Technology and later BOC Edwards (as BOC merged its vacuum business with Edwards, a well-known vacuum equipment maker). Through the late 1980s and 1990s, Airco Temescal sputtering and evaporation systems were sold under the BOC Edwards umbrella. Eventually, in the 2000s, BOC Edwards decided to divest the Temescal division. In 2007, Ferrotec Corporation (USA) acquired Temescal from Edwards Vacuum​ferrotec.com. This acquisition was highlighted by industry sources and marked Temescal’s new home under Ferrotec’s Thin Film Equipment group​linkedin.com​eetimes.com. Ferrotec continued the Temescal legacy primarily in the field of e-beam evaporators – Temescal Systems (a Ferrotec division) today produces modern evaporation systems (like the Temescal UEFC series and FC series) building on the original Temescal designs.

Under Ferrotec, Temescal has focused on electron-beam coating systems (the 2007 Ferrotec press release calls Temescal “the leading manufacturer of electron beam-based evaporative coating systems”​ferrotec.com). The sputtering system line that included the HRS 2550 was largely legacy by that point. It’s likely that active development of Temescal’s standalone sputter tools did not continue at the same pace post-1990s, as other companies dominated sputtering. Nonetheless, many HRS 2550 systems remained in use or were later refurbished/resold. The historical significance of the HRS 2550 is that it represents the cross-over of Temescal’s evaporation heritage into sputtering technology during the era when both methods were vying for thin-film deposition dominance. Temescal’s contributions (patents in magnetron sputtering, high-capacity batch tools) made systems like the HRS 2550 quite advanced for their time, offering high throughput for thin-film deposition outside of the newly emerging cluster tool paradigm.

Documentation and Current Market Availability

Because the Airco Temescal HRS 2550 is a legacy piece of equipment, official documentation (datasheets, manuals) can be obtained from archival sources or specialized vendors. The original manual for the HRS 2550 would include details on operation, maintenance, and schematics of its control system. While this manual is not freely published online to our knowledge, interested users can often acquire it through refurbishing companies or by contacting Ferrotec’s Temescal division for legacy support. In lieu of the original manual, the technical specifications and configuration details are often summarized in spec sheets provided by resellers​wotol.com​jmind.com. For example, J.M. Industries (a semiconductor equipment reseller) provides a specification list (as cited above) that essentially functions as a datasheet for the tool, covering dimensions, capacities, power requirements, and so forth. These spec sheets give prospective buyers or users a clear idea of the system’s capabilities.

In terms of current availability, the HRS 2550 is no longer manufactured new, but units are available on the secondary market. Companies that specialize in used semiconductor equipment frequently list the HRS 2550 for sale in refurbished condition. As of recent years, there have been listings for HRS 2550 systems from dealers in North America, often indicating the machine is fully rebuilt and operational​ebay.com​ebay.com. The going price for a refurbished HRS 2550 can vary depending on condition and included options (one eBay listing in 2025 quoted around $49k for a rebuilt unit)​ebay.com. Sites like eBay, Wotol, Machinio, and dedicated resellers have featured this model: e.g., an HRS 2550 in Massachusetts (ex-Airco Temescal, 3 targets, RF, diffusion pump) was advertised, highlighting its key features and offering installation/support by the seller​machinio.com​semistarcorp.com. Buyers are typically research labs, universities, or small fabs that need thin-film capability at lower cost.

It’s also worth noting that there are third-party service providers who can upgrade or support these older systems. Some offer retrofits like replacing the diffusion pump with a cryopump (as mentioned, a CTI-10 cryopump upgrade is common)​jmind.com, or modernizing the control electronics for better reliability. Additionally, at least one company (System Control Technologies) has offered a “replicated” system inspired by the Temescal 2550 platform​sctec.com​sctec.com – essentially a modern built clone that takes the core design (manual batch evaporation system in that case) and equips it with updated components. This speaks to the robust design of the original 2550 series – it has remained a reference point for high-throughput batch deposition.

In summary, the Airco Temescal HRS 2550 is a classic high-rate sputtering system known for its triple-target flexibility, high deposition speed, and batch processing capacity. It played a role in semiconductor thin-film deposition history and, despite its age, can still be found in operation today through refurbished units. For anyone interested in using or restoring an HRS 2550, resources are available via equipment resellers for specs and basic operation, and the original manuals (with schematics and process recipes) can likely be obtained from legacy documentation archives or the current Temescal support under Ferrotec. This makes the HRS 2550 not just a historical footnote, but a still-useful tool for appropriate applications in thin-film technology.

References:

• Airco Temescal HRS 2550 Specification Sheet (J.M. Industries / Wotol)​wotol.com​jmind.com – Detailed technical specifications and features of the HRS 2550.

• Airco Temescal HRS 2550 Resale Listings​jmind.com​machinio.com – Descriptions from refurbished equipment listings confirming configuration (3 targets, RF supply, pumps) and capabilities.

• Ferrotec Press Release (2007)​ferrotec.com – Corporate background on Temescal (founding in 1952 and industry focus).

• Compound Semiconductor Magazine – “Resurgence of E-beam Evaporation”​compoundsemiconductor.net – Historical note on Temescal’s development of magnetron sputtering under Airco Temescal.

• LinkedIn post by former Temescal manager​linkedin.com – Timeline of Temescal’s corporate ownership (Airco → BOC → Edwards → Ferrotec).

 

• Airco Temescal HRS 2550
  AIRCO TEMESCAL HRS 2550 SPUTTERING SYSTEM
  3 TARGETS
  AUTO/MANUAL VALVING
  DIRECT DRIVE MECHANICAL PUMP
  DIFFUSION PUMP
  CAN BE UPGRADED WITH ROTATING FIXTURE TO HOLD (4) 8" WAFERS
  
  The Airco...

• Temescal 2550
  CV 14, 14kw electron beam power supply choose diffusion or cryopump choose single pocket, 4 pocket or 6 pocket electron beam gun.