Sapphire Wafers Used in Physical Vapor Deposition
An Electro-Optical Engineer requested the following quote:
We are doing physical vapor deposition with a wide range of materials, metals, insulators, and dielectrics. Would you happen to know the best sapphire orientation for depositing these types of materials? I am also trying to understand what exactly the “C-M plane 0.2 deg” description means for the 50.8mm sapphire wafers you have listed. Would these suffice for depositing these materials?
UniversityWafer, Inc. Quoted:
“C-M plane 0.2 deg” means C-Plane(0001) Mis-cut or tilt 0.2±0.1 deg towards M-axis,this off-cut angle is the best surface angle using for your physical vapor deposition with a wide range of materials, metals, insulators, and dielectrics
Reference #266321 for specs and pricing.
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Silicon Pellets Used for Physical Vapor Deposition
A PhD candidate requested a quote for the following:
Do you sell Si as pellets? I don't want wafers. I want pellets so I can use it as a source material for a physical vapor depositio and in an ebeam based system. We are looking for Si pellets that are undoped, n-type and p-type. We'd purchase them at different doping levels (low, medium, high).
Undoped Silicon pellets
p-type (heavily doped) Silicon pellets
p-type (medium doped) Silicon pellets
p-type (low doped) Silicon pellets
n-type (heavily doped) Silicon pellets
n-type (medium doped) Silicon pellets
n-type (low doped) Silicon pellets
Reference #255944 for specs and pricing.
What is Physical Vapor Deposition (PVD)?
Physical Vapor Deposition (PVD) is a vacuum-based process used to deposit thin films of materials onto a substrate. The process involves heating the material to a high temperature, creating a vapor that is deposited onto the substrate, where it condenses and forms a solid film. The process is performed in a vacuum environment to prevent contamination of the deposited film and to ensure uniform deposition.
PVD can be used to deposit a wide range of materials, including metals, alloys, and dielectrics, and is commonly used in the manufacture of electronic devices, optical coatings, and decorative coatings. The benefits of PVD include the ability to produce high-quality, uniform coatings with precise control over thickness and composition, as well as the ability to deposit coatings on a variety of substrates.
What Substrates are Commonly Used in Physical Vapor Deposition?
There are several different types of PVD processes, including thermal evaporation, sputtering, and ion plating, each with its own advantages and disadvantages. The specific PVD process used will depend on the material being deposited and the desired properties of the final coating.
In Physical Vapor Deposition (PVD), a wide range of substrates can be used, including:
Metals: Such as aluminum, stainless steel, titanium, and copper.
Glass: Used in the manufacture of optical coatings and displays.
Plastics: Used in the production of decorative coatings and protective coatings for consumer goods.
Silicon: Used in the manufacture of microelectronics, solar cells, and photovoltaic devices.
Ceramics: Used for high-temperature and wear-resistant coatings.
Composites: Used for advanced materials with specific properties.
The choice of substrate material will depend on the intended application and the desired properties of the final coating. For example, in the production of electronic devices, silicon wafers are commonly used as the substrate, while in the production of decorative coatings, metal or plastic substrates may be used. The surface quality and preparation of the substrate can also play a critical role in the success of the PVD process and the quality of the deposited film.
Physical Vapor Deposition (PVD) is a widely used technique in several fields of research and industry, including:
Materials Science: Researchers in this field use PVD to study the properties of materials and to develop new materials with specific properties.
Microelectronics: PVD is used to deposit thin films of materials onto silicon wafers, which are used in the manufacture of microchips, transistors, and other electronic devices.
Optics: PVD is used to deposit optical coatings on glass, lenses, and other optical components, to improve their performance and durability.
Energy: PVD is used in the manufacture of solar cells and photovoltaic devices, to deposit thin films of materials with specific optical and electrical properties.
Surface Engineering: PVD is used to deposit protective and decorative coatings on a wide range of products, including consumer goods, medical devices, and aerospace components.
Biotechnology: PVD is used in the production of bio-compatible coatings for medical implants and devices, to improve their biocompatibility and performance.
Overall, PVD is a versatile technique with a wide range of applications, making it an important tool for researchers and industry in many fields.