Super Thin Silicon Wafers

University Wafer Silicon Wafers and Semicondcutor Substrates Services
University Silicon Wafer for Production

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We offer freestanding super thin silicon wafers with thicknesses ranging from 5µm to 100µm and with diameters from 5mm to 6.  The thin Silicon wafers are true mirror finish DSP, good surface flatness, haze-free, void-free, and have low surface RMS (typical 1-2nm) and an ultralow TTV typically less than +/-1µm.

Below are just some of out wafers uses.

Lab-On-Chip ELISA

* More efficient Solar Wafers, up to 51%!
* Micro Counter
* Micro-Cantilever Sensing and Actuation Components
* Photo Dynamic Therapy Laser
* Light Engine for Portable Information Display, and
* Dynamic Diagnostics Tools for Light Emitting Devices

 

Super Thin Silicon Wafers

Below is a recent client request:

We are planning to use thin silicon wafers to develop a post-sample attenuator for some X-ray experiments. My plan is to bond a thicker small diameter wafer (eg. 50 or 100um thickness, 10mm diameter) to the center of a lager thinner one  (eg. 5um, 50mm diameter). The setup also requires a laser-drilled hole of diameter approximately 1.5mm for the direct X-ray beam to pass through. Could you also give me some details of the holding ring for thin wafers mentioned on your website?.

Click here to see the wafer post-sample attenuator X-ray experiment.

 

University Wafer along with our partners now specializes optical MEMS and specialty silicon products. These products and services incude

  • · Deformable mirrors for adaptive optics
  • · Large format ASIC drivers for deformable mirrors
  • · MEMS, telecom, instrumentations, and piezoelectrics
  • · Speciality silicon products such as super thin silicon wafers
  • · Silicon nitride TEM windows/grids
  • · PMN-PT/Silicon Unimorphs for optics
  • · MEMS, measurement, and piezoelectric industries
  • · Wafer services including bonding, coating, grinding/lapping/polishing, and wafer dicing
  • We have a large in stock inventory of super-thin Silicon ranging from 5um, 25um, 50um and so on.

Our super-thin silicon production is based on a proprietary combination of the following

  • · Wafer Bonding
  • · Lapping
  • · Polishing
  • · Debodning Process

Diameter/dimension range from <25.4mm - 150mm, larger is some cases.

The thin wafers are haze and void free. They have low surface roughness of 1-2nm and TTV +/-1um.

We can also supply an attachemnt with rigid wafer ring for our thin silicon wafers. This allows for easy handling.

We can also provide the following services on our thin wafers

    • · Wafer Dicing
    • · Silicon wafer lapping and polishing to 5-50um thickness
    • · Wafer Bonding to mate a cavity wfer with a bare wafer
    • · PECVD Nitride, LS Nitride, Oxide and LS Oxide on Silicon Including super thin silicon wafers
    • · Ebeam and thermal evaporation of metal coatings (Ti, Cr, Au, Pt, Pd, Al, Cu, Ag etc) on our wafers including our super-thin wfers
    • · IC assembly (wafer dicing, die attachment, wire bonding, flip chip bonding)